2
D-NE004/NE005/NE0050/NE006
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
...................................................................
3
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
4
3-2.
Upper Lid Assy, Cabinet (Middle) Assy,
Cabinet (Lower) Assy ......................................................
4
3-3.
Optical Pick-Up (CDM-3525A) ......................................
5
3-4.
JACK Board, MAIN Board .............................................
5
3-5.
LPF Board .......................................................................
6
4.
TEST MODE
...............................................................
7
5.
ELECTRICAL ADJUSTMENT
.............................
7
6.
DIAGRAMS
.................................................................
8
6-1.
Block Diagram ................................................................
9
6-2.
Printed Wiring Board
– MAIN Board (Side A), LPF Board (Side A) – ............. 10
6-3.
Printed Wiring Board
– MAIN Board (Side B), LPF Board (Side B),
JACK Board – ................................................................. 11
6-4.
Schematic Diagram – MAIN Board (1/2),
JACK Board (1/2) – ........................................................ 12
6-5.
Schematic Diagram – MAIN Board (2/2), LPF Board,
JACK Board (2/2) – ........................................................ 13
6-6.
IC Pin Function Description ............................................ 15
7.
EXPLODED VIEWS
7-1.
Upper Lid, Cabinet (Middle) Section .............................. 17
7-2.
Cabinet (Lower) Section ................................................. 18
8.
ELECTRICAL PARTS LIST
.................................. 19
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE WITH
MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
0
SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS
PUBLIÉS PAR SONY.
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