![background image](http://html.mh-extra.com/html/sony/cmt-ne3-micro-hi-fi-component-system/cmt-ne3-micro-hi-fi-component-system_service-manual_420416026.webp)
HCD-NE3
22
22
JW505
JW503
JW507
JW502
JW511
JW506
JW501
CN502
JW504
JW508
JW509
JW510
JW512
JW513
EP903
R520
R515
C512
C510
C503
C509
R516
C516
C506
C511
R504
R509
IC501
R519
CN501
C514
C513
R506
R518
R501
R517
C505
R507
R511
R514
R508
R505
R502
R503
R512
C501
C507
CNB501
C520
C521
AMP BOARD
1-861-726-
11
(11)
HP BOARD
1-861-728-
11
(11)
1
1
4
9
J301
PHONES
1
7
15
5
1
(CHASSIS)
6-8.
PRINTED WIRING BOARDS – AMP Section –
•
See page 17 for Circuit Boards Location.
:Uses unleaded solder.