![background image](http://html.mh-extra.com/html/sony/cmt-hp7-executive-microsystem/cmt-hp7-executive-microsystem_service-manual_420365031.webp)
29
29
HCD-HP7
8-2. Printed Wiring Boards — BD Board —
• See page 26 for Circuit Boards Location.
•
: Uses unleaded solder.
C860
R860
FB803
FB805
FB804
FB806
R806
R807
R747
C761
R761
R762
R746
3
4
BD BOARD
(COMPONENT SIDE)
1-688-077-
(11)
11
OPTICAL
PICK-UP
BLOCK
(KSM-213D)
IC803
BD BOARD
(CONDUCTOR SIDE)
1-688-077-
(11)
11
M702
(SPINDLE)
M
+
–
M701
(SLED)
M
+
–
S701
(LIMIT IN)
TP
(RF)
TP
(FE)
TP
(TE)
TP
(VC)
E
B
C
MAIN
BOARD
CN312
(Page 33)
7
1
14
8
22
28
15
21
1
A
B
C
D
E
F
2
3
4
5
6
7
8
9
10
11
Ref. No.
Location
IC721
E-8
IC722
C-9
IC801
E-3
IC802
F-3
IC803
F-9
Q701
B-7
• Semiconductor
Location
Summary of Contents for CMT-HP7 - Executive Microsystem
Page 71: ...3 SS CHP7 MEMO ...