— 2 —
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
TABLE OF CONTENTS
1. SERVICING NOTE
···························································· 5
2. GENERAL
············································································ 6
3. DISASSEMBLY
3-1. Slide Rack ····································································· 8
3-2. Front Panel ···································································· 8
4. TEST MODE
········································································ 9
5. ELECTRICAL BLOCK CHECKING
·····························
11
6. DIAGRAMS
6-1. Circuit Boards Location ·············································· 13
6-2. Block Diagram ···························································· 15
6-3. Schematic Diagram — Main Section (1/2) — ············ 17
6-4. Schematic Diagram — Main Section (2/2) — ············ 19
6-5. Printed Wiring Board — Main Section — ·················· 21
6-6. Schematic Diagram— Display Section — ·················· 23
6-7. Printed Wiring Board — Display Section — ·············· 25
6-8. Schematic Diagram — Power section — ···················· 27
6-9. Printed Wiring Board — Power section — ················· 29
6-10. Schematic Diagram — Servo section — ····················· 31
6-11. Printed Wiring Board — Servo section — ·················· 33
6-12. Schematic Diagram — Motor section — ···················· 35
6-13. Printed Wiring Board — Motor section — ················· 36
6-14. IC Block Diagrams ······················································ 37
6-15. IC Pin Function Description ········································ 39
7. EXPLODED VIEWS
··················································
43
8. ELECTRICAL PARTS LIST
········································· 48
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK
!
OR DOT-
TED LINE WITH MARK
!
ON THE SCHEMATIC
DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL
TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUM-
BERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This caution
label is located
inside the unit.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
MODEL IDENTIFICATION
— BACK PANEL —
4-997-198-0: XB920 (AEP) model
4-997-198-1: XB920E (UK) model
4-997-198-3: XB920E (Singapore, Malaysia) model
