XBR-55X850D/855D/857D, 65X850D/855D/857D, 75X850D/855D/857D
195
APPENDIX-2
How to disassemble HEAT SINK (BMFW2 board)
<NOTE>
HEAT SINK are already attached to the B board for service.
If you need to disassemble HEAT SINK from B board for repair,
Please cut
HOLDER,HS WS(MUF)
with tool (nippers) from B side of B board.
However, please do it carefully because some damage may be given
to the neighborhood parts or the B board itself.
When you re-assemble HEAT SINK,
Do not reuse HOLDER,HS WS. Should be replaced to new parts.
And
Potting operation is necessary
at the same time for re-assembly of HEAT SINK.
Please refer SBR "New Potting TIM Operation for board repair" for details.
nipper
HEAT SINK (MUFF CP)
HEAT SINK (MUFF)
HOLDER, (HS MUF)
4-549-188-01
HOLDER, HS WS (MUF)
4-548-743-01
Unhook HOLDER,(HS MUF)
Push
Push
Do not reuse HOLDER. Should be replaced to new parts.