Working Instruction, Mechanical
3/000 21-1/FEA 209 544/126 A
Company Internal
©
Sony Ericsson Mobile Communications AB
Approved according to FEA matrix doc number
1.2 General cautions
The following cautions are considered to be generic for all phone models and will not be repeated in
the Disassembly, Replacements and Reassembly sections:
•
S
WITCH OFF THE PHONE AND REMOVE SIM
CARD
AND MEMORY STICK BEFORE STARTING
DISASSEMBLING THE PHONE
!
•
K
EEP ALL CONTACT SURFACES CLEAN
!
•
B
E CAREFUL WHEN USING TOOLS LIKE THE DENTIST HOOK
,
TWEEZERS
,
OPENING TOOLS
,
P
LECTRUMK
ETC
.
TO AVOID SCRATCHES OR DAMAGES TO THE EXTERIOR AND INTERIOR PARTS OF THE PHONE
!
•
B
E CAREFUL NOT TO DAMAGE ANY CONTACT SPRINGS
!
•
R
EMEMBER TO REMOVE THE PROTECTION FOILS ON NEW PARTS SUCH AS THE FRONT COVER AND
LCD
!
•
N
EVER TOUCH THE DISPLAY GLASS
!
•
U
SE AIR BLOW EQUIPMENT TO KEEP THE FRONT WINDOW AND DISPLAY MODULE DUST FREE
!
1.3 Adhesives
Use a dentist hook and/or the tweezers to remove old adhesives.
Clean the surface with isopropyl alcohol before attaching new adhesives.
1.4 Recurrent
Repair
Actions
How to open a board-to-board connector with the front
opening tool.
How to open and close a FPC connector – Be very careful
with the hinge mechanism.
Remove the
memory stick!
Remove the
SIM card!
