Operation Instructions:
1. Insert plug into
2. Put the power switch on the location
of "ON".
The indicator lightens, then wait 5
minutes before using in order to
avoid nozzle and pipe to be blocked
by tin chip and due to unsufficient
heating.
3. If there is any tin chip blocked in
the nozzle and pipe, please wait 5
minutes after the power switch
lightens, put needle into nozzle and
pipe and clean left articles by
pulling back and forth.
(do cleaning when the vacuum pump
starts.)
4. Put the nozzle on the tin, which you
intend to take for 2-3 seconds, and
shake the nozzle, then the pins of IC
will move and tins have been melted.
After tin is melted, press the tri-
gger and start vacuum pump, then tin
will be immediately absorbed. If tin
is not completed melted, the tin can
not be cleaned, of course parts are
not able to be taken down. In this
case, please add some solder and re-
peat the a/m operation instruction.
Maintenance:
Replacement of Filter
If tins are filled in the f ilting
pipe, the vacuum pressure will be
pipe, the vacuum pressure will be
decreased. Please replace accor-
ding to the following instructions:
1. Put the button of "PULL" backward,
rotate 90 and then fix it.
2. You can take out filter by pulling
the pipe backward and moving away
from the location of "O" ring.
3. Clean the tin chip in filting pipe.
4. If there is too much tin in the
first layer steel fibre filter and
the filter has been used many
times, please replace a new one.
Please also replace a new filter,
when the second-layer-filter
absovbs soldering flux fully.
5. When doing replacement, the first
layer steel fibre filter should be
put beside the nozzle and the
beside the pump.
* Please do not use vacuum pump, if
there is no filter. The vacuum pump
will be out of order, when you start
vacuum pump without putting filter in.
Please do not use the desolder, when
the filter is not installed.
* If the supply cord is damaged, it must
be replaced by the manufacturer. its
service agent or similarly qualified
persons in order to avoid a hazard.
