Chapter 6 - Mechanical specification
© Softing Industrial Automation GmbH
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6.2
Host PCB layout
Recommended footprint
The PCB footprint dimensions may be modified based on user experience and/or process capability.
Routing under the CommModule MBP
Note
The host PCB footprint must not contain any exposed copper under the module except the
pads interfacing the CommModule MBP to avoid any contact with traces on the module.
Summary of Contents for Data Flow commModule MBP
Page 1: ...Softing Industrial Automation GmbH commModule MBP Hardware Manual Version EN 022018 1 00...
Page 23: ...Chapter 8 CE Compliance Softing Industrial Automation GmbH 23...
Page 24: ...commModule MBP Hardware Manual 24 Softing Industrial Automation GmbH...
Page 25: ...Chapter 8 CE Compliance Softing Industrial Automation GmbH 25...
Page 26: ...commModule MBP Hardware Manual 26 Softing Industrial Automation GmbH...
Page 28: ...commModule MBP Hardware Manual 28 Softing Industrial Automation GmbH...
Page 29: ...Chapter 8 CE Compliance Softing Industrial Automation GmbH 29...
Page 30: ...commModule MBP Hardware Manual 30 Softing Industrial Automation GmbH...
Page 31: ...Chapter 8 CE Compliance Softing Industrial Automation GmbH 31...
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Page 33: ...Chapter 8 CE Compliance Softing Industrial Automation GmbH 33...
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Page 35: ...Chapter 8 CE Compliance Softing Industrial Automation GmbH 35 8 3 Declaration of Conformity...