SMART PCIE-6001, Installation And Use Manual

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Hardware Preparation and Installation
PCIE-6001 Installation and Use (6806800U73B) 25
2.3.1 Environmental and Thermal Requirements
The following table provides the environmental and the thermal requirements for the PCIE-
6001 card.
Operating temperatures refer to the temperature of the incoming air passing across
the card and out of the faceplate and not the temperature of the components.
NOTICE
Card Damage
High humidity and condensation on the card surface causes short circuits.
Do not operate the card outside the specified environmental limits. Make sure that
the card is completely dry and there is no moisture on its surface before applying
power.
Table 2-1 Environmental and Thermal Requirements
Requirement Operating Non-Operating
Cooling Method Forced air -
Temperature
+5°C to +40°C (normal operation),
+5°C to +55°C (exceptional operation),
according to NEBS Standard GR-63-
CORE
-40°C to +70°C
Forced air flow, air
volume, pressure loss
(reference to sea level)
5CFM @ 2 °C host system ambient,
12.5CFM @ 35°C host system ambient,
and 20CFM @ 55°C host system
ambient
-
Temperature Change ±0.5°C/min ±1°C/min
Relative Humidity 5% to 95% non-condensing at +40°C
5% to 95% non-condensing at
+40°C
Vibration (vertical) 10 Min 0.01G (sinusoidal) 5 – 200Hz -
Vibration (transverse) 10 Min. 0.01G (sinusoidal) 5 – 200Hz -
Vibration (longitudinal) 10 Min. 0.01G (sinusoidal) 5 – 200Hz -
Freefall -
1200 mm/all edges and
corners (packed state) 100
mm/3 axis (unpacked)
Altitude Sea level