SHANGHAI SIMCOM LIMITED
10
Table1-2 Terms and acronyms (cont.)
Term
Definition
HSUPA
High-speed uplink packet access
I2C
Inter-integrated circuit
I2S
Inter-IC sound
ISP
Image signal processing
JTAG
Joint Test Action Group (ANSI/ICEEE Std. 1149.1-1990)
kbps
kilobits per second
LCD
Liquid crystal display
LPA
Low-power audio
LPASS
Low-power audio subsystem
LPDDR
Low-power DDR
LSB
Defines whether the LSB is the least significant bit or least significant
byte. All instances of LSB used in this manual are assumed to be LSByte,
unless otherwise specified.
LTE
Long term evolution
MBP
Mobile broadcast platform
MDM
Mobile data modem
MIPI
Mobile industry processor interface
MPM
Modem power management
MSB
Defines whether the MSB is the most significant bit or most significant
byte. All instances of MSB used in this manual are assumed to be
MSByte, unless otherwise specified.
MTP
Modem test platform
NSP
Nanoscale package
PA
Power amplifier
PCM
Pulse-coded modulation
PI
Power in
PDM
Pulse-density modulation
PM
Power management
PNSP
Package-on-package nanoscale package
PO
Power out
PVS
Process voltage scaling
RBDS
Radio broadcast data system
RDS
Radio data system
RLP
Radio link protocol
RPM
Resource power manager
SBI
Serial bus interface
SD
Secure digital
SDC
Secure digital controller
SEE
Secure Execution Environment
SFS
Secure file system
SIM
Subscriber identity module
SMT
Surface mount technology
SPI
Serial peripheral interface
Summary of Contents for SIMT 1502
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