SimCom SIM5320AL, User Manual

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SIM5320AL_User Manual_V1.01 2014-08-20 57
6
Guide for Production
6.1 Top and Bottom View of SIM5320AL
Figure 40: Top and bottom view of SIM5320AL
These test points are only used for module manufacturing and testing. They are not for customer’s
application.
6.2 Typical Solder Reflow Profile
For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In
final board assembly, the typical solder reflow profile will be determined by the largest component on the
board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown
below is only a generic recommendation and should be adjusted to the specific application and
manufacturing constraints.