SIM340 Hardware Design
4 Antenna interface
The RF interface has an impedance of 50
Ω
. To suit the physical design of individual applications
SIM340 offers alternatives:
Recommended approach: antenna connector on the component side of the PCB
Antenna pad and grounding plane placed on the bottom side.
To minimize the loss on the RF cable, it need be very careful to choose RF cable. We recommend
the insertion loss should be meet following requirement:
GSM850/GSM900<1dB
DCS1800/PCS1900<1.5dB
4.1 Antenna installation
4.1.1 Antenna connector
SIM340 uses MURATA’s MM9329-2700RA1 RF connector on the module side; we recommend
to use MURATA’s MXTK92XXXXX as matching connector on the application side. Please refer
to appendix for detail info about MURATA’s MXTK92XXXXX.
4.1.2 Antenna pad
The antenna can be soldered to the pad, or attached via contact springs. To help you to ground the
antenna, SIM340 comes with a grounding plane located close to the antenna pad.
SIM340 material properties:
SIM340 PCB Material: FR4
Antenna pad: Gold plated pad
Antenna pad soldering temperature: we recommend 350
℃
.
Note: The soldering time for antenna pad and GND pad are different, less than 3s for antenna
pad and less than 10s for GND pad.
Module RF output power
Table
24
: SIM340 conducted RF output power
Frequency
Max
Min
GSM850
33dBm ±2db
5dBm±5db
SIM340_HD_V3.09
18.03.2009
53
