Si886xxISO-EVB
8
Rev. 0.1
6. Bill of Materials
Table 3.
Si886xxISO-EVB Bill of Materials
Part Reference
Description
Manufacturer
Manufacturer Part Number
C2
CAP, 10
μ
F, 50 V, ±20%, X7R, 1210
Venkel
C1210X7R500-106M
C4
CAP, 10
μ
F, 10 V, ±20%, X7R, 1206
Venkel
C1206X7R100-106M
C5 C9 C12 C14
CAP, 0.1
μ
F, 10 V, ±10%, X7R, 0603
Venkel
C0603X7R100-104K
C6
CAP, 0.47
μ
F, 16 V, ±10%, X7R, 0805
Venkel
C0805X7R160-474K
C8
CAP, 100 pF, 50 V, ±10%, X7R, 0603
Venkel
C0603X7R500-101K
C10
CAP, 22
μ
F, 25 V, ±10%, X7R, 1210
Venkel
C1210X7R250-226M
C11
CAP, 1.5 nF, 25 V, ±10%, X5R, 0603
Venkel
C0603X5R250-152K
C18
CAP, 0.047
μ
F, 100 V, ±10%, X7R, 0805
Venkel
C0805X7R101-473K
C19
CAP, 68 pF, 100 V, ±10%, C0G, 0603
Venkel
C0603C0G101-680K
D1
DIO, SUPER BARRIER, 50 V, 5.0A, SMA
Diodes Inc.
SBRT5A50SA
D6
DIO, FAST, 200 V, 1.0A, PowerDI-123
Diodes Inc.
DFLU1200-7
D7
RES, 0
1A, ThickFilm, 0603
Venkel
CR0603-16W-000
D20
DIO, ZENER, 28 V, 500 mW, SOD123
On Semi
MMSZ5255BT1G
D21 D22
LED, RED, 631 nM, 20 mA, 2 V, 54mcd, 0603
Lite-On
LTST-C190KRKT
J1 J2
CONN, TERM BLOCK 2POS, 5MM PCB
Phoenix Contact
1729018
JP1 JP2 JP5 JP6
JP10 JP11 JP13
Header, 2x1, 0.1” pitch, Tin Plated
Samtec
TSW-102-07-T-S
JP9
Header, 3x1, 0.1” pitch, Tin Plated
Samtec
TSW-103-07-T-S
JS9 JS13
Shunt, 1x2, 0.1” pitch, Tin plating
Samtec
SNT-100-BK-T
MH1 MH2 MH3
MH4
HDW, Screw, 4-40 x 1/4" Pan Head, Slotted,
Nylon
Richco Plastic Co
NSS-4-4-01
Q1
TRANSISTOR, MOSFET, N-CHNL, 100 V, 3.7A,
3W, Switching, SOT223
Fairchild
FDT3612
Q2
TRANSISTOR, NPN, 30 V, 600 mA, SOT23
On Semi
MMBT2222LT1
R5
RES, 49.9K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-4992F
R6
RES, 13.3K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-1332F
R7
RES, 100K, 1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-1003F
R8
RES, 27.4
,1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-27R4F
R12
RES, 0.1
, 1/2W, ±1%, ThickFilm, 1206
Venkel
LCR1206-R100F
R13
RES, 4.32K, 1/10W, ±1%, ThickFilm, 0603
Venkel
CR0603-10W-4321F
R14
RES, 19.6K, 1/16W, ±1%, ThickFilm, 0603
Venkel
CR0603-16W-1962F
