ICD-4000-OEM
© SightLine Applications, Inc.
3
3.4
Customer Integration - Key Points
✓
Provide a sufficient heat sink for the Snapdragon 820 processor and other major components. Close
attention to heatsinking is critical. See the
✓
Expose Ethernet port (on J4) to an accessible connector for debug, command and control, and
firmware update capability.
✓
Expose debug serial port On J7 to an accessible connector for debugging.
✓
For in-system recovery, it is recommended to expose the USB programming/debugging port and the
FASTBOOT_RECOVERY switch/button on J7 to a system accessible connector.
✓
If you are designing a custom system interface board with the 4000-SOM contact SightLine
Hardware Engineering prior to design for assistance.
4
Thermal Management
4.1
Heatsink Guidelines
IMPORTANT:
Close attention to heatsinking is critical.
The component temp range for the InForce 6601 SOM and the Ethernet PHY are 0°C to 70°C, all other
components temp range is -40°C to 85°C. All hardware requires some form of mechanical heatsink.
Customers must design a heatsink in conjunction with their system integration effort. It should provide
a direct conducted path to a significant thermal mass (the wall of a gimbal or housing) or use an active
cooling (fans) that
has proven to be successful in cases where a full thermal analysis is not performed.
The provided SOM cover aids heatsinking when the provided mechanical interface is a flat plate and is
our baseline. This cover may be removed, and thermal performance improved if a machined heatsink
interface is implemented.
STEP files for the heatsink interface are available from SightLine that can
help with heatsink design and integration.
The 4000-OEM typical power consumption is less than 6W @ 12V. System settings provide an option
for a low power mode with no video output but power reduced by 2-4W, see
IMPORTANT:
The internal temperature, reported in Panel Plus, should not 85°C (185°F) or
the SOM processor will start to reduce clock speed and eventually shut down. Internal high
temperatures for extended periods can cause permanent damage
.
4.2
Gap Pads
Use some form of thermally conductive material for filling gaps between the hot components and the
heat sink. Examples such as the
TG-A6200
Ultra Soft Thermal Conductive Pad (6W/mK or
higher) are recommended. The compression of the pad allows for greater mounting tolerances. The
compression of the gap pad also provides additional support for the board and does not require as
much force to maintain contact.
4.2.1
Gap Pads SOM Cover
When integrating the OEM with the SOM cover/heat spreader installed (onto a flat surface heatsink),
use TGlobal TG-A6200-25-40-5.0 (or Sightline PN: SLA-PAD-020-01), Thermal Pad 1.0 x 1.6 x 0.02 inch.
