Sierra Wireless MC5720 Hardware Integration Manual Download Page 22 | Manualshive

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Sierra Wireless MC5720 Hardware Integration Manual Download Page 22

MC5720/8755/8765 Hardware Integration Guide

Important compliance
information for North American
users

The

MC5720/MC8755/MC8765

modem

has

been

granted

modular

approval

for

mobile

applications.

Integrators

may

use

the

MC5720/MC8755/MC8765

modem

in

their

final

products

without

additional

FCC

/

IC

(Industry

Canada)

certification

if

they

meet

the

following

conditions.

Otherwise,

additional

FCC

/

IC

approvals

must

be

obtained.

1.

At

least

20

cm

separation

distance

between

the

antenna

and

the

user’s

body

must

be

maintained

at

all

times.

2.

To

comply

with

FCC

/

IC

regulations

limiting

both

maximum

RF

output

power

and

human

exposure

to

RF

radiation,

the

maximum

antenna

gain

including

cable

loss

in

a

mobile

‐

only

exposure

condition

must

not

exceed:

·

8 dBi

in

the

Cellular

band

and

4 dBi

in

the

PCS

band

for

the

MC8755/MC8765

·

4.65

dBi

in

the

Cellular

band

and

3.35

dBi

in

the

PCS

band

for

the

MC5720

3.

The

MC5720/MC8755/MC8765

modem

and

its

antenna

must

not

be

co

‐

located

or

operating

in

conjunction

with

any

other

transmitter

or

antenna

within

a

host

device.

4.

A

label

must

be

affixed

to

the

outside

of

the

end

product

into

which

the

MC5720/MC8755/MC8765

modem

is

incorpo

‐

rated,

with

a

statement

similar

to

the

following:

·

For

MC5720:

This

device

contains

TX

FCC

ID:

N7N

‐

MC5720

This

equipment

contains

equipment

certified

under

IC:

2417C

‐

MC5720

·

For

MC8755:

This

device

contains

TX

FCC

ID:

N7NMC8755

This

equipment

contains

equipment

certified

under

IC:

2417C

‐

MC8755

·

For

MC8765:

This

device

contains

TX

FCC

ID:

N7NMC8765

This

equipment

contains

equipment

certified

under

IC:

2417C

‐

MC8765

5.

A

user

manual

with

the

end

product

must

clearly

indicate

the

operating

requirements

and

conditions

that

must

be

observed

to

ensure

compliance

with

current

FCC

/

IC

RF

exposure

guidelines.

The

end

product

with

an

embedded

MC5720/MC8755/MC8765

modem

may

also

need

to

pass

the

FCC

Part

15

unintentional

emission

testing

requirements

and

be

properly

authorized

per

FCC

Part

15.

20

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Summary of Contents for MC5720

Page 1: ...2130114 Rev 0 92 MC5720 MC8755 MC8765 MiniCard Hardware Integration Guide Proprietary and Confidential...

Page 2: ......

Page 3: ...ts occurrences or claims giving rise to liability be in excess of the price paid by the purchaser for the Sierra Wireless product Portions of this product may be covered by some or all of the followin...

Page 4: ...osoft Corporation Qualcomm is a registered trademark of Qualcomm Incorpo rated Other trademarks are the property of the respective owners Sales Desk Phone 1 604 232 1488 Hours 8 00 AM to 5 00 PM Pacif...

Page 5: ...ic discharge ESD 9 Module power states 10 Disconnected state 10 Off state 10 Normal state 11 Low power mode 11 Usage models 11 RF Integration 13 RF connection 13 Ground connection 13 Shielding 14 Ante...

Page 6: ...Hardware Integration Guide LED output 17 Regulatory Information 19 Important notice 19 Safety and hazards 19 Important compliance information for North American users 20 Acronyms and Definitions 23 In...

Page 7: ...rstanding of network technology and experience in integrating hardware components into electronic equipment is assumed The Universal Development Kit Sierra Wireless manufactures a Universal Developmen...

Page 8: ...o power supply integration 3 RF Integration p 13 Describes antenna connection methods and grounding issues RF interference and desense issues 4 Host Module Communication Interface p 17 Describes the U...

Page 9: ...ations Part 15 Radio Frequency Devices This section of the FCC Code of Federal Regulations Title 47 deals with radio frequency devices including EM shielding requirements The regulation can be downloa...

Page 10: ...describes SIM testing methods The document 3GPP TS 11 10 4 can be downloaded from www 3gpp org PCI Express Mini Card Electromechanical Specification Revision 1 1 The document can be downloaded from ww...

Page 11: ...ower supply as indicated in PCI Express Mini Card Electromechanical Specifi cation Revision 1 1 The MC8755 8765 has more power pins than the MC5720 due to higher peak current requirements for GSM devi...

Page 12: ...utdown Low power airplane mode The module is active but RF is disabled State machines are implemented in the module to monitor the power supply and operating temperature Disconnected state This state...

Page 13: ...r User Equipment UE Release 6 CFUN 0 command EM5625 MC5720 CnS Reference Document 2130643 CNS_RADIO_POWER 0x1075 or MC87xx Modem CnS Reference Document 2130602 Disable Modem Usage models Usage models...

Page 14: ...C5720 8755 8765 Hardware Integration Guide The module automatically enters slotted sleep mode when there is no transmission or reception occurring SCI 2 Transmit power is assumed to be 3 dBm 12 213011...

Page 15: ...RF cable losses to the antenna the recommended maximum cable loss for antenna cabling is 0 5 dB Figure 3 1 Antenna connection points and mounting holes Ground connection When connecting the module to...

Page 16: ...stom designed antennas A skilled RF engineer should do the development to ensure that the RF performance is maintained Identify the bands that need to be supported particularly when both the MC5720 an...

Page 17: ...e RF signal The power supply ripple limit for the module is no more than 200 mVp p 1 Hz to 100 kHz This limit includes voltage ripple due to transmitter burst activity Interference from other wireless...

Page 18: ...reless devices can contribute to RF desense Components that are most likely to cause RF desense include Microprocessor and memory Display panel and display drivers Switching mode power supplies These...

Page 19: ...iniCard specification summarized in Table 4 1 Module is transmitting LED is flashing intermittently or receiving proportional to activity on the interface 50 duty cycle 3 Hz minimum blink rate 20 Hz m...

Page 20: ...MC5720 8755 8765 Hardware Integration Guide Figure 4 1 Example LED VCC 3 3V Current limiting Resistor LED MIO MiniCard 18 2130114...

Page 21: ...0 MC8755 MC8765 modem In areas where blasting is in progress Where explosive atmospheres may be present including refuelling points fuel depots and chemical plants Near medical equipment Near life sup...

Page 22: ...the MC5720 3 The MC5720 MC8755 MC8765 modem and its antenna must not be co located or operating in conjunction with any other transmitter or antenna within a host device 4 A label must be affixed to t...

Page 23: ...atory Information Note If this module is intended for use in a portable device you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2 1093 and IC RSS 102 Rev 0 92 Nov...

Page 24: ...MC5720 8755 8765 Hardware Integration Guide 22 2130114...

Page 25: ...rence voltage dBm Decibels relative to 1 mW Decibel mW 10 x log10 Pwr mW 1mW DUT Device Under Test EDGE Enhanced Data rates for GSM Evolution EM Embedded Module ESD ElectroStatic Discharge FER Frame E...

Page 26: ...al that the receiver can measure Sensitivity RF Measure of lowest power signal at the receiver input that can provide a prescribed BER BLER SNR value at the receiver output SIM Subscriber Identity Mod...

Page 27: ...e RF disconnected module power state 10 diversity antenna disabling 15 E electrostatic discharge See ESD ESD protection requirements 9 10 testing techniques document IEC 61000 4 2 7 F FCC regulations...

Page 28: ...ument See PSD PSD MC5720 details 7 MC8755 8765 details 7 R regulatory information 19 21 FCC 20 limitation of liability 19 safety and hazards 19 RF antenna cable loss maximum 13 antenna connection cons...

Page 29: ......

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