Hardware Design Guide
Rev 3.0 Aug.19
36
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Manual Soldering
Soldering Iron
Heat Temperature: Under 380°C | Time: Under 3 sec.
Notes
:
1.
To prevent further oxidation, do not directly touch the soldering pads on the
surface of the PCB board.
2.
The solder paste must be defrosted to room temperature before use so that it
can return to its optimal working temperature. The time required for this
procedure is unique and dependent on the properties of the solder paste
used.
3.
The steel plate must be properly assessed before and after use, so its
measurement stays strictly within the specification set by SOP.
4.
Watch out for the spacing between the soldering joints, as excess solder may
cause electrical shortages.
5.
Exercise caution and do not use an excessive amount of flux due to possible
siphon effects on neighboring components, which may lead to electrical
shortages.
6.
Do not use a heat gun for long periods of time when removing the shielding or
inner components of the GPS module, as it is very likely to cause a shift to
the inner components which will lead to electrical shortages.