Siemens SXG75 Page 36 Service Manual Download | Manualshive

Page: 36 / 61

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Release

1.1

Technical Documentation

11/2005

TD_Repair_L1-L3_SXG75_R1.1.pdf

Page 36 of 61

The access to the JPICS server which is located in Kamp – Lintfort is protected by chip card

and in addition using secure socket layer (SSL) connection.

The JPICS server is only available for authorized users with a specially coded smart card.

These smart cards and the administration of the JPICS web server and the PICS database

– server can only be provided by the JPICS – TRUST – Center of the responsible

department in Kamp – Lintfort.

In case of any questions or requests concerning smart cards or administration of the

databases please ask your responsible BenQ Customer Care Manager.

Company Confidential

2005©BenQ

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Summary of Contents for SXG75

Page 1: ...pair_L1 L3_SXG75_R1 1 pdf Page 1 of 61 Service Manual SXG 75 Level 1 3 Release Date Department Notes to change R 1 0 29 11 2005 BenQ Mobile CC S CES New document R 1 1 22 02 2006 BenQ Mobile CC S CES SWU Process modified Company Confidential 2005 BenQ ...

Page 2: ... Usage 30 10 JPICS Java based Product Information Controlling System 35 11 International Mobile Equipment Identity IMEI 41 12 General Testing Information 42 13 Introduction of Service Repair Documentation Level 3 SXG75 49 14 List of available level 2 5light parts 50 15 Hardware requirements 50 16 SXG75 Board layout 51 17 SIM Card Problems 52 18 IO Connector Problems 53 19 B to B connector Problems...

Page 3: ...umination White 4LEDs in series integrated 3x4 Block Keypad Front side decorated Partly bridgeless keypad i e horizontally bridgeless 12 key block o 9 tactile finder on key 5 colour adapted to u shaped aluminium brushed sheet metal piece Four blue LED s for keypad Function block with Operator key Five way Navikey Chrome plated navi key ring with center push button operator logo can be printed on t...

Page 4: ...es all other Use Cases 40 voices Hands free mode Different selectable volume levels for handsfree handset and ringer mode for the amount see SW product description Antenna Integrated Quad band antenna Receiver Sensitivity Compliant with 3GPP specification TS34 121 Rel 99 Transmitter Power Compliant with 3GPP specification TS34 121 Rel 99 The transmitter output power is compliant to following Power...

Page 5: ...ollowing compatible interfaces to accessories electrically by the Lumberg I O connector Lumberg slim antenna connection by courtesy of RF connector IR and Bluetooth interface is implemented Slot wit reader for additional reduced size MultiMediaCard exchangeable is available car holder interface is implemented Company Confidential 2005 BenQ ...

Page 6: ... hole on the bottom side Additional speciality is a slot for exchangeable RS MultiMediaCard at the side of the phone The keypad is new for a Siemens brick phone and has beside the usual navigation and number key block beneath the display and the 2 side keys on both side surfaces further 4 edge keys 2 on each side beside the LCD module for extended UMTS related functionality Special design element ...

Page 7: ... 61 4 Exploded View of SXG75 Side Cover Side Keys Vibramotor Upper Case Keypad Flexible PCB Display Module PCB Microphone Lower Case Disassembled Camera Cover Earphone MMC Holder UMTS Camera Cover Camera UMTS Camera Screws Rear Cover Battery Battery Cover Company Confidential 2005 BenQ ...

Page 8: ...vironment and with ESD protected equipment tools For all activities the international ESD regulations have to be considered For more details please check information in c market https market benqmobile com SO welcome lookup asp There you can find the document ESD Guideline Step 1 Remove Battery Cover and Battery Step 2 Remove Rear Cover by pushing it with both thumbs forwards Company Confidential ...

Page 9: ...mentation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 9 of 61 Step 3 Remove screws with Torque Screwdriver Screws size T5 Step 4 Remove Side Cover by using Alternative Opening Tool carefully Step 5 Company Confidential 2005 BenQ ...

Page 10: ...ation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 10 of 61 Step 6 Remove Upper Case by using Alternative Opening Tool carefully Step 7 Step 8 Disconnect Flex Cable from PCB by using Tweezers carefully Company Confidential 2005 BenQ ...

Page 11: ...f 61 Step 9 Remove MMC Holder by pushing it with Alternative Opening Tool outside the frame Step 10 Use Alternative Opening Tool to remove PCB from Lower Case carefully Step 11 To avoid scratches it is mandatory to place a Protection Foil onto the Display Company Confidential 2005 BenQ ...

Page 12: ... 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 12 of 61 Step 12 Remove Flexible PCB with Alternative Opening Tool carefully The Loudspeaker is not removable Step 13 Step 14 Remove Side keys by using Tweezers Company Confidential 2005 BenQ ...

Page 13: ...11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 13 of 61 Step 15 Step 16 Use Tweezers to remove Keypad Step 17 Remove Microphone by using Tweezers carefully Be careful with the spring contacts of the Microphone Company Confidential 2005 BenQ ...

Page 14: ...Repair_L1 L3_SXG75_R1 1 pdf Page 14 of 61 Step 18 Remove Vibramotor by using Tweezers carefully Step 19 Remove Earphone by using Tweezers carefully Step 20 Use Alternative Opening Tool to remove Camera Cover carefully Company Confidential 2005 BenQ ...

Page 15: ...Release 1 1 Technical Documentation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 15 of 61 Step 21 Step 22 Step 23 Disconnect Flex Cable from PCB with Tweezers Company Confidential 2005 BenQ ...

Page 16: ...PCB by using Alternative Opening Tool very carefully Step 25 Put the Camera Ejector Jig professional through the four edges between the Camera and the Camera Connector Now push the Ejector Jig and pull out the Camera carefully Step 26 Remove UMTS Camera Cover by using Tweezers carefully Company Confidential 2005 BenQ ...

Page 17: ... with Alternative Opening Tool very carefully Overview Lower Parts Overview Upper Parts Flexible PCB Side Cover Upper Case Display PCB Battery Rear Cover Lower Case Microphone Vibramotor Earphone MMC Holder Camera Cover Keypad Disassembled Camera Cove Camera Battery cover UMTS Camera Sidekeys Company Confidential 2005 BenQ ...

Page 18: ... TD_Repair_L1 L3_SXG75_R1 1 pdf Page 18 of 61 6 Assembly of SXG75 Step 1 Assemble UMTS Camera by using Tweezers Step 2 Connect the UMTS Camera with PCB by using Tweezers Step 3 Use Tweezers to assemble Camera Cover Company Confidential 2005 BenQ ...

Page 19: ...2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 19 of 61 Step 4 Assemble Camera by using Camera Ejector Jig Step 5 Assemble Display by fixing it in the given frame Take care of the Display Step 6 Assemble Camera Cover Company Confidential 2005 BenQ ...

Page 20: ...nical Documentation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 20 of 61 Step 7 Step 8 Assemble Earphone by using Tweezers carefully Step 9 Assemble Vibramotor by using Tweezers carefully Company Confidential 2005 BenQ ...

Page 21: ...on 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 21 of 61 Step 10 Assemble Microphone by using Tweezers Be careful with the spring contacts of the Microphone Step 11 Assemble Side keys with Tweezers Step 12 Company Confidential 2005 BenQ ...

Page 22: ...75_R1 1 pdf Page 22 of 61 Step 13 Use Tweezers to assemble Keypad Step 14 Assemble Flexible PCB by using Tweezers Push it carefully with both thumbs in the Upper Case Step 15 Before assembling PCB in the Upper Case remove Display Foil Company Confidential 2005 BenQ ...

Page 23: ...chnical Documentation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 23 of 61 Step 16 Step 17 Assemble PCB by fixing it in the Upper Case Step 18 To assemble PCB connect it with Flex Cable Company Confidential 2005 BenQ ...

Page 24: ...ntation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 24 of 61 Step 19 Assemble MMC holder by pushing it in the given frame Step 20 Fix the Upper Case on the before assembled Lower Case and PCB Step 21 Company Confidential 2005 BenQ ...

Page 25: ...ge 25 of 61 Step 22 Place screws by using Torque Screwdriver Top screw Antenna Screw size T5 Torque 17 cNm Centre Bottom screws Screw size T5 Torque 20 cNm Step 23 Assemble side cover Press the side cover onto the frame Step 24 Assemble Rear Cover Company Confidential 2005 BenQ ...

Page 26: ...Release 1 1 Technical Documentation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 26 of 61 Step 25 Assemble Battery Step 26 Assemble Battery Cover Company Confidential 2005 BenQ ...

Page 27: ...nt For disassembling assembling Torque Screwdriver Part Number F 30032 P 228 A1 Opening tool Case opening without destroying Part Number F 30032 P 38 A1 Alternative Opening tool Part Number F30032 P583 A1 Tweezers Camera Ejector Tool Professional Part Number F30032 P514 A1 For testing All mobile phones have to be tested with the GRT Software The service partner is responsible to ensure that all re...

Page 28: ...t Sep 1 Select Settings SWUP JPICS Step 2 Proceed as follows Select all required Variants you need to repair click onto the in front of the product name Check Com Port setting If necessary change it Check speed setting Select always the lowest speed if your PC does not have a fast serial card Enter the value for JPICS Server Timeout Be careful this value defines how long GRT tries to reach the ser...

Page 29: ...ct to the database Start with Connect It you IT infrastructure parameter have changed use this button to move to the configuration mask End the connection with a click onto the Exit button appearing after successful data exchange GRT Software has now finished all required settings and configuration tasks All files have been down and uploaded In dependency of the selected number of mobile phones an...

Page 30: ...risation have to be available Operator SWAP This area is only accessible if you are released by the service management to perform SW Updates for Net Operators Basis for the decision if a SW Update is authorised by Siemens is the so called Master Table Customer data will be erased without any exception and any chance to influence by the user JPICS hardware and authorisation have to be available Ope...

Page 31: ...ion of Service Release Table SW c Version of Master Table SW Window to select the mobile phone CPU Select boxes for Content xfs Settings mapping Attention Activation of the boxes will cause erase of customer date while SW Update 1 1 1 1 1 1 3 Automatic read out function of phone type Variant Appearing in the window above Remarks In case of malfunction please check o Is the correct phone type selec...

Page 32: ...Start SW Update Remarks The decision about a Siemens authorised SW Update depends only on the Service Release Table The SW which is booted by GRT can be below the SW mentioned in the Service Release Table if this SW is not released for the Net Operator If xfs and mapping are activated GRT will erase in any case the customer data even if the action is cancelled If the user wants to download an othe...

Page 33: ...te the boxes in front of xfs and mapping Remarks The decision about a Siemens authorised SW Update depends only on the Master Table The user has no chance to influence the decision Xfs and mapping are always activated there is no chance to deactivate them GRT will erase in any case the customer data even if the action is cancelled If the user wants to download an other variant then the automatical...

Page 34: ...4 Read out phone type Variant Appears in the window above 2 Remarks The decision about a Siemens authorised SW Update depends only on the Master Table The user has no chance to influence the decision Xfs and mapping can be activated on demand GRT will erase in any case the customer data even if the action is cancelled If the user wants to download an other variant then the automatically identified...

Page 35: ... 35 of 61 10 JPICS Java based Product Information Controlling System Overview The following functions are available for the LSO General mobile information Generate PINCODE Generate SIMLOCK UNLOCK Code Print IMEI labels Lock Unlock and Test the BF Bus Company Confidential 2005 BenQ ...

Page 36: ...server is only available for authorized users with a specially coded smart card These smart cards and the administration of the JPICS web server and the PICS database server can only be provided by the JPICS TRUST Center of the responsible department in Kamp Lintfort In case of any questions or requests concerning smart cards or administration of the databases please ask your responsible BenQ Cust...

Page 37: ...w this order 1 Smart Card Reader Omnikey Cardman 2020 USB or Cardman 3121 USB 2 CardOS interface Siemens Version 3 0 B 3 Java Runtime Environment Sun 4 Java additional components Every user is responsible for a proper installation matching the license agreements For installation and further access you need the following 1 The JPICS Installation CD 2 The Smart Card JPICS These cards can be ordered ...

Page 38: ... Codes In the JPICS application you can choose to generate Masterphone codes Simlock Unlock Codes Masterphone codes The Masterphone code is used to unlock blocked mobiles Masterphone codes can only be supplied for mobiles which have been delivered in a regular manner Company Confidential 2005 BenQ ...

Page 39: ...de The Simlock Unlock Codes can only be generated if the following conditions are given Mobile must have an active Simlock inside The user must be given the authorization to obtain Simlock Unlock Codes for the variant of the operator to which the mobile was delivered last time Company Confidential 2005 BenQ ...

Page 40: ...bels are being printed the setting Print test labels 9 is activated by default After having printed a well aligned test label you can uncheck the setting and print the correct label Hint For correct printing of IMEI labels you must have a Zebra label printer with special material that fits for label printing This printer has to be connected to local LPT1 printer port also see Installation of IMPRI...

Page 41: ...rt number for the SXG75 is S30880 8900 xxx where the last for letters specify the housing and software variant SXG75 series IMEI label is accessible by removing the battery Re use of IMEI label is possible by using a hair dryer to remove the IMEI label On this IMEI label BenQ has also includes the data code for production or service which conforms to the industrial standard DIN EN 60062 The data c...

Page 42: ...equipment tools For all activities the international ESD regulations have to be considered Get delivery Ensure that every required information like fault description customer data a s o is available Ensure that the packing of the defective items is according to packing requirements Ensure that there is a description available how to unpack the defective items and what to do with them Enter data in...

Page 43: ...ty of the battery Check battery charging capability of the mobile phone Check charging capability of the power supply Check current consumption of the mobile phone in different mode Visual inspection Check the entire board for liquid damages Check the entire board for electrical damages Check the housing of the mobile phone for damages SW update Carry out a software update and data reset according...

Page 44: ...st file Band 1 GSM900 Band 2 GSM1800 2 Test file Band 1 GSM1900 Internal Antenna Test case Parameter Measurements Limits 1 Location Update GSM Band 1 BS Power 55 dBm middle BCCH Display check individual check 2 Call from BS low TCH highest PCL BS Power 75 dBm middle BCCH Ringer Loudspeaker check individual check 3 TX GSM Band 1 low TCH highest PCL BS Power 75 dBm middle BCCH Frequency Error Phase ...

Page 45: ...nd 2 high TCH second highest PCL BS Power 75 dBm middle BCCH Frequency Error Phase Error RMS Phase Error Peak Average Power Power Time Template GSM Spec 12 RX GSM Band2 high TCH BS Power 102 dBm 50 Frames middle BCCH RX Level RX Qual BER Class Ib BER Class II BER Erased Frames GSM Spec 13 Call relaese from MS Final Inspection The final inspection contains 1 A 100 network test location update and s...

Page 46: ...n Update Band 1 2 Call from NodeB 3 WCDMA TX Test UARFCN 10750 ULTA 30 Peak Power dBm Magnitude Error RMS EVM RMS Phase Error RMS Frequence Error Average WCDMA Spec 4 Call relaese from NodeB External Antenna 5 Call from UE 6 Audio Test Audio Loop Individual check 7 WCDMA TX Min Power Peak Power dBm Magnitude Error RMS EVM RMS Phase Error RMS Frequence Error Average WCDMA Spec 8 WCDMA TX Max Power ...

Page 47: ... Test SIM Card There are two different Test SIM Cards in use 1 Test SIM Card from the company ORGA Pin 1 number 0000 PUK 1 12345678 Pin 2 number 0000 PUK 2 23456789 2 Test SIM Card from the company T D1 Pin 1 number 1234 PUK 76543210 Pin 2 number 5678 PUK 2 98765432 Company Confidential 2005 BenQ ...

Page 48: ...ter A B Sanyo Date code example N 9 A SY Year N 2001 O 2002 Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B NEC Date code example N 8 A NT Year N 2001 O 2002 Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B Panasonic Date code example O N A PAN Year N 2001 O 2002 Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov...

Page 49: ... done according to the latest CF110 Level 1 2 repair documentation It has to be ensured that every repaired mobile Phone is checked according to the latest released General Test Instruction document both documents are available in the Technical Support section of the C market Check at least weekly C market for updates and consider all CF110 related Customer Care Information SXG75 Partnumber on IME...

Page 50: ...CTOR RS MMC READER X75 SXG75 X1500 L36334 Z97 C337 CONNECTOR SIM CARD READER K1 SXG75 X1900 L36197 F5008 F341 CONNECTOR BOARD TO BOARD 20 POL SXG75 X1901 L50634 Z97 C379 CONNECTOR CAMERA SOCKET SXG75 X200 L36334 Z93 C297 CONNECTOR ANTENNA 6mm SXG75 X2000 L50697 F5008 F288 BOARD TO BOARD 16 POL 0 5MM SXG75 X2201 L50634 Z97 C340 BOARD TO BOARD 30 POL 15 Hardware requirements according to General sol...

Page 51: ... of 61 16 SXG75 Board layout Upper board side Lower board side Connector Battery Connector Antenna Connector Board to Board 20 Connector Display Connector Front Camera Connector SIM Card Reader IRDA IO Jack Slim Connector RS MMC Connector Camera socket Company Confidential 2005 BenQ ...

Page 52: ...reader visually Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Ω Exchange SIM Card reader Continue with higher repair level Exchange the damaged Filter okay okay okay not okay not okay check for twisted or bent contacts check for dry joints Back to customer without repair Use soldering iron to remove defective co...

Page 53: ...Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Ω okay not okay check for twisted or bent contacts check for dry joints Continue with higher repair level Exchange IO connector Check the dust inside the IO connector not okay okay okay Use soldering iron to remove defective component Avoid excessive heat Watch surro...

Page 54: ...tially high if excessive heat is used while removal or soldering of the SLIM Lumberg connector Please follow these instructions a Remove the SLIM Lumberg connector with a soldering iron and Desolder Wick b Clean the Pads afterwards c Solder the new connecter by using soldering iron under consideration of the max allowed temperature range Samples of critical area Lock mechanism damaged Lock mechani...

Page 55: ...us of the B to B connector visually okay check for twisted or bent contacts check for dry joints Continue with higher repair level Exchange B to B connector caused by customer Back to customer without repair okay not okay Connector Board to Board Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order num...

Page 56: ... level Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Ω okay okay not okay check for twisted or bent contacts check for dry joints caused by customer Back to customer without repair okay not okay Connector BATTERY Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components R...

Page 57: ...ultimeter to check connection between spring contacts and soldering contacts The value must be 0Ω Exchange camera connector Continue with higher repair level okay not okay not okay check for twisted or bent contacts check for dry joints Back to customer without repair Connector CAMERA Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new co...

Page 58: ...isually Exchange IRDA okay not okay check for twisted or bent contacts check for dry joints Continue with higher repair level Back to customer without repair IRDA Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L36197 F5008 F492 E commerce order name IRDA 115 2 KBIT Soldering temperature 36...

Page 59: ...connection between spring contacts and soldering contacts The value must be 0Ω Exchange display connector Continue with higher repair level okay not okay not okay check for twisted or bent contacts check for dry joints Back to customer without repair Connector DISPLAY Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterward...

Page 60: ...ultimeter to check connection between spring contacts and soldering contacts The value must be 0Ω check for twisted or bent contacts check for dry joints Back to customer without repair Connector MMC Use soldering iron to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C415 E commerce order name CONNE...

Page 61: ...Release 1 1 Technical Documentation 11 2005 TD_Repair_L1 L3_SXG75_R1 1 pdf Page 61 of 61 Company Confidential 2005 BenQ ...

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