SICK
Device
7
4
6
Power Supply
U
=
8
=
9
1
2
3
I
5
System
Controller
Figure 9: Example: Occurrence of equipotential bonding currents in the system configuration
1
System controller
2
Device
3
Voltage supply
4
Grounding point 2
5
Closed current loop with equalizing currents via cable
6
Ground potential difference
7
Grounding point 1
8
Metal housing
9
Electrical cable
Remedy
The most common solution to prevent equipotential bonding currents on the cables is
to ensure low-impedance and current-carrying equipotential bonding.
Measure for small system installations
For smaller installations with only slight potential differences, insulated mounting of the
device and peripheral devices may be an adequate solution.
U
System
Controller
Power Supply
SICK
Device
8
6
5
2
1
3
4
7
=
9
=
ß
Figure 10: Example: Prevention of equipotential bonding currents in the system configuration by
the insulated mounting of the device
1
System controller
2
Device
3
Voltage supply
4
Grounding point 3
6
ELECTRICAL INSTALLATION
30
O P E R A T I N G I N S T R U C T I O N S | RFU61x IO-Link
8026854//2021-09-01 | SICK
Subject to change without notice
