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FLOWSIC100 Flare · Operating Instructions · 8013344/11L2/V 2-5/2018-10 · © SICK Engineering GmbH
Assembly and Installation
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The internal diameter Di of the pipeline is required for further configuration of the
geometric data (
). It can be calculated as follows:
We recommend determining the wall thickness by measurement and averaging at 4
positions around the pipe. Suitable ultrasonic measurement techniques can be used for
this.
3.3.3
Installing the MCUP control unit
3.3.3.1
Version without explosion protection and version for Ex zone 2
Install the control unit in a protected location that is easily accessible. Observe the
following points during fitting:
●
Maintain the ambient temperature according to the Technical Data; take possible
radiant heat into consideration (shield if necessary).
●
Protect against direct sunlight.
●
Whenever possible, choose an assembly location with minimum vibrations; dampen any
vibrations if necessary.
●
Leave enough clearance for cables and opening the door.
●
Select an installation location free of chemical influence (esp. for use in ex zone 2).
Used enclosure material (white plastic [glass fiber reinforced PBT]) and encapsulating
material (black or white epoxy resin) may degrade particularly in the presence of hydro-
carbons and hydrogen sulfide among others.
Named components must be inspected periodically (details
Using suitable cables, the MCUP control unit can be located up to 1000 m away from the
sender/receiver units. We therefore recommend fitting the MCUP in a control room
(measuring station or similar) to ensure free access to the MCUP. This considerably
simplifies communication with FLOWSIC100 Flare in order to set parameters or to locate
malfunction or error causes.
It is advantageous to provide weather protection (tin roof or similar), made on-site, for use
outdoors.
The wall thickness data according to ANSI table can deviate from the actual
wall thickness by up to 13%.
WARNING:
Exposure to some chemicals may degrade the sealing properties of
materials used in the following devices:
●
Relay (sealed device) type AZ830-2C-12DSE and AZ832-2C-12DSE
(manufactured by ZETTLER) assembled on the processor board of the
MCU
●
Relay (sealed device) type V23092-B1024-A301 (manufactured by
SCHRACK) or type FTR-LYRA024Y (manufactured by FUJITSU), assem-
bled in the optional digital output module (SICK part no. 2034659)
Extremely ambient temperatures as well as higher concentrations of the
chemicals may expedite the degradation.
Use long connection cables between the MCUP and the sender/receiver
units to install the MCUP in a location with safe conditions.
Di
U
π
---- 2 W
•
–
=
U = Pipeline circumference at assembly location
W= Wall thickness
