Sharp LC-23LE448RU, Service Manual

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2. REMOVAL AND INSTALLATION OF
3. When IC starts moving back and forth easily after
FLAT PACKAGE IC
desoldering completely, pickup the corner of the IC using
tweezers and remove the IC by moving with the IC
REMOVAL desoldering machine. (Refer to Fig. 2-3.)
1. Put Masking Tape (cotton tape) around the Flat Package NOTE
IC to protect other parts from any damage.
(Refer to Fig. 2-1.) Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC
NOTE
leads or solder lands under the IC when removing it.
Masking is carried out on all the parts located within
10 mm distance from IC leads.
Fig 2-1
Masking Tape
(Cotton Tape)
IC
Blower type IC
desoldering machine
Tweezers
2. Heat the IC leads using a blower type IC desoldering
machine. (Refer to Fig. 2-2.)
NOTE
Do not rotate or move the IC back and forth , until IC 4. Peel off the Masking Tape.
can move back and forth easily after desoldering the
leads completely.
5. Absorb the solder left on the pattern using the Braided
Shield Wire. (Refer to Fig. 2-4.)
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
Fig. 2-1
Fig. 2-2
Fig. 2-3
Fig. 2-4
Blower type IC
desoldering machine
IC
IC
IC pattern
Braided Shield Wire
Soldering Iron
B2-1
DISASSEMBLY INSTRUCTIONS (continued)