2.2
Technical specifications
Processors
NXP i.MX6 Family, based on ARM
®
CORTEX-A9 processors
-
i.MX6S Solo - Single core up to 1GHz
-
i.MX6D Dual - Dual core up to 1.2GHz per core
-
i.MX6DL Dual Lite - Dual core up to 1GHz per core
-
i.MX6Q Quad - Quad core up to 1.2GHz per core
Memory
Up to 2GB DDR3l soldered onboard (up to 1GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL
®
ES2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG
™
(only i.MX6D and
i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video Interface
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface
HDMI Interface
Video Input Port / Camera connector (only with PCB rev. C or higher)
Video Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage
Onboard eMMC Disk, up to 8 GB *
mSATA Half-length slot (shared with miniPCI-express)
* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.
Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global
capacity shown for Disk Properties will be less than expected. Please also consider
that a portion of disk capacity will be used by internal Flash Controller for Disk
management, so final capacity will be lower
USB
3 x standard USB 2.0 Type A
1 x USB OTG on micro-AB connector
Internal USB for optional WiFi module
Networking
Gigabit Ethernet connector
Audio
AC
’
97 Audio Codec
Mic In, Line out internal pin header connector
PCI Express
Half-mini PCI-e slot, shared with mSATA (only PCI-e 1.1 and Gen2 are supported)
Serial ports
1x RS-232 serial port
TTL debug UART (Tx, RX only)
CAN interface internal connector
Other Interfaces
I2C touch Connector
Internal connector for power and reset buttons
Power supply
+12VDC ± 10%
Embedded additional RTC circuitry for lowest power consumption
Optional RTC Battery with lead cable and connector
Operating temperature:
0°C ÷ +70°C** (commercial version)
-40°C ÷ +85°C (industrial version)
Dimensions: 80 x 67 mm (3.15
”
x 2.64
”
).
Supported Operating Systems:
Linux
** is to be considered at any point of the heatspreader/heatsink. Actual
temperature will widely depend on application, enclosure and/or
environment. Upon customer to consider specific cooling solutions for the
final system.
Please also check paragraph 4.1
