COMe-mEL10 - User Guide Rev. 1.1
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2.8.2.
Module Height
The COM Express® specification defines a module height of approximately 13 mm, when measured from the bottom of
the module’s PCB board, to the top of the heatspreader, see Figure 8.
The overall height of the module and carrier board depends on the implemented cooling solution. The height of the
cooling solution is not specified in the COMe specification.
Figure 8: Module and Carrier Height
1
Heatspreader
2
Module PCB board
3
Carrier PCB board
4
Heatspreader standoff(s)
5
Connector standoff(s) 5 mm or 8 mm
6
13 mm +/- 0.65 mm
2.8.3.
Metal Heat Slug Dimensions
The metal heat slug 35 mm x 24 mm (1.38” x 0.94”) is located on top of the multi-chip package.
Figure 9: Metal Heat Slug Dimensions
*All dimensions shown in mm.
1
Metal heat slug
1
1
2
5
13 mm +/- 0.65 mm
3
4
