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COMe-bTL6 - User Guide. Rev. 1.5
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Figure 9: Module and Carrier Height
1
Heatspreader
2
Module PCB board
3
Carrier PCB board
4
Heatspreader standoff(s)
5
Connector standoff(s) 5 mm or 8 mm
6
Copper core and Thermal Interface
Material (TIM)
2.8.3.
Heatspreader Plate Assembly Dimensions
The module’s cooling concept uses a heatspreader plate assembly 95 mm x 125 mm (3.7“x 4.9“) fasten on the module
via the heatspreader plate standoffs, see Figure 10, pos. 4. The heatspreader plate works as a COM Express® standard
thermal interface and must be used with a heat sink or external cooling devices to maintain the heatspreader plate at
proper operating temperatures. For module and heatspreader plate height information, see Chapter 2.8.2: Module
Height.
Figure 10: Heatspreader Plate Assembly (viewed from bottom side)
1
Copper core
2
TIM Screen printed onto contact
surface 0.1 to 0.15 mm thickness
3
TIM screen printed onto contact surface
0.25 mm +/- 0.05 mm
4
Heatspreader standoffs
2
13 mm +/- 0.65 mm
1
6
3
4
5
5
4
4
1
4
4
4
4
2
3
4
4