COMe-bTL6 - User Guide. Rev. 1.5
// 33
2.5.
Thermal Management
2.5.1.
Heatspreader Plate Assembly
A heatspreader plate assembly is available from Kontron for the COMe-bTL6. The heatspreader plate assembly is
NOT a heat sink. The heatspreader plate transfers heat as quickly as possible from the processor using a copper core
positioned directly above the processor and a Thermal Interface Material (TIM). The heatspreader plate is factory
prepared with a TIM screen printed on the contacts, see Figure 10, pos. 2 and 3 and may be fasten on the module
without additional user actions.
The heatspreader plate works as a COM Express® standard thermal interface and must be used with a heat sink or
external cooling devices to maintain the heatspreader plate at proper operating temperatures. Under worst-case
conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature on any spot of
the heatspreader's surface according to the module’s specification:
60°C for commercial temperature grade modules
75°C for extended temperature grade modules (E1)
85°C for industrial temperature grade modules by design (E2)
2.5.2.
Active/Passive Cooling Solutions
Both active and passive thermal management approaches can be used with the heatspreader plate. The optimum
cooling solution depends on the COM Express® application and environmental conditions. Kontron’s active or passive
cooling solutions are designed to cover the power and thermal dissipation for a commercial temperature range used
in housing with a suitable airflow.
2.5.3.
Operating with Kontron Heatspreader Plate (HSP) Assembly
The operating temperature requirements are:
Maximum ambient temperature with ambient being the air surrounding the module
Maximum measurable temperature on any part on the heatspreader's surface
Table 24: Heatspreader Temperature Specification
Temperature Grade
Requirements
Commercial Grade
at 60°C HSP temperature on MCP @ 100% load needs to run at nominal frequency
Extended Grade (E1)
at 75°C HSP temperature the MCP @ 75% load is allowed to start throttling for
thermal protection
Industrial Grade (E2)
at 85°C HSP temperature the MCP @ 50% load is allowed to start throttling for
thermal protection
2.5.4.
Operating without Kontron Heatspreader Plate (HSP) Assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.