Wireless audio Module
Version 1.0
Samsung Electronics
page 2 of 8
1. Introduction
This features an embedded 8052 MCU, new low-power modes and support for the 5 GHz dual-band RF
receivers. This supports up to 4 stereo audio streams and comes together with additional features such as: data
encryption, pairing functionality, bi-directional control data messages, full autonomy for receivers,
low-power audio snooze mode, WLAN detection and automatic frequency allocation. This module itself
provides the basic functions of audio processing and buffering, Data Link Layer and Physical Layer.
This enables the module to provide the digital interfaces on one side and the radio interfaces on the other side.
The core chipset is from STS, part number DARR 83. This application is designed for DVD/BD-HTS, and all
kinds of AV-R model.
2. Hardware Architecture:
2.1 Main Chipset Information
Item Vendor
Part
Number
BBIC
STS DARR
83
RFIC Airoha
AL
5230
2.2 Circuit Block Diagram
The major internal and external block diagram of Samsung 5GHz dual-band wireless audio module is
illustrated in Figure 1-1.
Figure 1-1 Samsung 5GHz dual-band wireless audio module block diagram and System Interface
2.3 Module output power information
- Module output power within filter
Class type
TX power(typ.)
Data rate
10dBm
22Mbps
