1-2
1. Precautions
1-2. Servicing Precautions
WARNING:
An electrolytic capacitor installed with the wrong polarity might explode.
Caution:
Before servicing units covered by this service manual, read and follow the Safety Precautions section of
this manual.
Note:
If unforeseen circumstances create conflict between the following servicing precautions and any of the
safety precautions, always follow the safety precautions.
1-2-1 General Servicing Precautions
Always unplug the unit’s AC power cord from the AC power source and disconnect the DC Power Jack before
1.
attempting to:
(a) remove or reinstall any component or assembly, (b) disconnect PCB plugs or connectors, (c) connect a test
component in parallel with an electrolytic capacitor.
Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
2.
used. The internal wiring is sometimes clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
3.
the area around the serviced part has not been damaged.
Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels,
4.
input terminals and earphone jacks).
Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON.
5.
Connect an insulation resistance meter (500 V) to theblades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be
greater than 1 megohm.
Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
6.
always remove the instrument’s ground lead last.
1-3. Electrostatically Sensitive Devices (ESD) Precautions
Some semiconductor (solid state) devices can be easily damaged by static electricity. Such components are commonly
called Electrostatically Sensitive Devices (ESD). Examples of typical ESD are integrated circuits and some field-effect
transistors. The following techniques will reduce the incidence of component damage caused by static electricity.
Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
1.
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. To avoid a shock hazard,
be sure to remove the wrist strap before applying power to the LED TV.
After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
2.
accumulation of an electrostatic charge.
Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESDs.
3.
Use only a grounded-tip soldering iron to solder or desolder ESDs.
4.
Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static” can generate
5.
electrical charges sufficient to damage ESDs.
Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs
6.
are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive
materials.
Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
7.
material to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit and observe all other safety precautions.
Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together,
8.
or lifting your foot from a carpeted floor can generate enough static electricity to damage an ESD.
Summary of Contents for UN32D6500VF
Page 37: ...4 4 4 Troubleshooting Location Main A B Detail A B ...
Page 38: ...4 5 4 Troubleshooting Location T Con C Detail C ...
Page 40: ...4 7 4 Troubleshooting Location Main B A Detail A B ...
Page 41: ...4 8 4 Troubleshooting WAVEFORMS 1 PC input V sink H sink R G B 2 LVDS output ...
Page 43: ...4 10 4 Troubleshooting Location Main B A Detail A B ...
Page 44: ...4 11 4 Troubleshooting WAVEFORMS 1 PC input V sink H sink R G B 2 LVDS output ...
Page 46: ...4 13 4 Troubleshooting Location Main B A Detail A B ...
Page 47: ...4 14 4 Troubleshooting WAVEFORMS 1 CVBS OUT Grey Bar 2 LVDS output ...
Page 49: ...4 16 4 Troubleshooting Location Main B A Detail A B ...
Page 50: ...4 17 4 Troubleshooting WAVEFORMS 1 LVDS output 2 CH_CLK CH_VALID ...
Page 52: ...4 19 4 Troubleshooting Location Main B D C A Detail A B C D ...
Page 53: ...4 20 4 Troubleshooting WAVEFORMS 1 CVBS OUT Grey Bar 2 LVDS output ...
Page 55: ...4 22 4 Troubleshooting Location Main B A Detail A B ...
Page 56: ...4 23 4 Troubleshooting WAVEFORMS 1 Compnent_Y Gray scale Pb Pr Color bar 2 LVDS output ...
Page 58: ...4 25 4 Troubleshooting Location Main B A C Detail A B C ...
Page 59: ...4 26 4 Troubleshooting WAVEFORMS 1 MCLK LRCLK PCM_I2C_DATA 2 Speaker Monitor OUT SPDIF OUT ...