Samsung Suede R710, Service Manual

Page: 45 / 205

Samsung
Confidential
Samsung
Confidential
Samsung
Confidential
SRP Sheet Number: 3 of 78
PORT #
Mini Card (WIBRO : RSVD)
0
3
DOCKING PORT 0
Mini Card (Golan)
Expresas Card
- F
TBD
TBD
9 WWAN/WIBRO (TBD)
TBD
-
Intel LAN
14.318MHz
30h
0011 010x
CK-505
24.576MHz (TBD)
34h
Primary DC system power supply (7 to 21V)
VIDEO PEG
1.5V switched off power rail (off in S3-S5)
VDC
DMB
Expresas Card
VCC_CORE
USB2.0 #3 (USB5) : E
DB400 (PCI Express Clocks)
TBD
USB2.0 #4 (EHCI) : H
1
DCh Clock Buffer for PCI Express
B,C,D,C
PCI Express Assign
4Ch
58h
P5V
P0.9V
TBD : (ALS) 0111 0010
VTT for CPU, Crestline & ICH8-M
5.0V switched on power rail
3
DOCKING PORT 0
P5V_AUX
ICH_CORE
LCD Pannel Detect
Devices
Core Voltage for CPU
P1.25V_M
Crystal / Oscillator
32.768KHz
P3.3V_M
3.3V always power rail (for Micom)
FREQUENCY DEVICE
1.25V switched power rail for ME (on in M0/M1)
TBD : (AUX DISPLAY)
Real Time Clock
10MHz
LAN
3Ch
HD64F2169/2160
24.576MHz
EMA
C8h
1394
Crystal
A
B
25MHz
C
D
-
9Ch
4
3
SMBUS Master
Thermal Sensor
2
1
Clock, Unused Clock Output Disable
A4h
PROPRIETARY INFORMATION THAT IS
CK-505M (Clock Generator) 1101 001x
SAMSUNG ELECTRONICS CO’S PROPERTY.
P2.5V
2 A,B
P1.05V (VCCP)
3.3V switched off power rail (off in S3-S5)
B -
5.0V switched off power rail (off in S3-S5)
P3.3V
PORT # ASSIGNED TO
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
Bluetooth
0
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Internal MAC
AD25
DRAW
CHECK
AD31(internal)
AD24(internal)
APPROVAL
MODULE CODE
Interrupts
B,C,D
DATE
DEV. STEP
USB2.0 #1 (USB1) : D
USB2.0 #2 (USB4) : C
REV
3.3V always power rail (by KBC3_ALWS_ON)
E
-
0.9V power rail for DDR
PART NO.
I C / SMB Address
Devices
PAGE
ELECTRONICS
CPU Thermal Sensor
SODIMM0
3.3V always power rail (for LAN) LAN_3.3V
1001 110x
1010 000x
3.3V switched power rail for ME (on in M0/M1)
P3.3V_A
BOARD INFORMATION
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
LAST EDIT
TITLE
PCI Devices
Devices
OF
SAMSUNG
IDSEL#
Cardbus
A
B
USB
Hub to PCI
C
D
LPC bridge/IDE/AC97/SMBUS
AD29(internal)
4
3
AD30(internal)
REQ/GNT#
2
1
3
USB2.0 #0 (USB0) : A
1.5V switched on power rail
2.5V switched off power rail (off in S3-S5)
B
-
P1.5V
P1.5V_AUX
-
-
Core Voltage for CPU
3.3V switched on power rail
-
Address
1.8V power rail for DDR
P3.3V_AUX
ICH8-m
SODIMM1
P1.8V_AUX
MICOM_P3V
Master
1010 010x
1.8V switched off power rail (off in S3-S5) P1.8V
Hex
A0h
MCH_CORE Core Voltage for CPU
Bus
-
1.05V switched power rail for ME (on in M0/M1) P1.05V_M
-
D2h
-
8
2
Voltage Rails
Mini PCI Express
Test Port (RSVD)
AD23
AC Link
0011 110x
1100 1000
-
MiniPCI SLOT
82566
TBD
USB PORT Assign
SYSTEM PORT 0
PCI Express Docking TBD
SYSTEM PORT 1 1
TPM TBD
2
4
Thermal Sensor on SODIMM0 0011 000x
5
Resolution
- Thermal Sensor on SODIMM1
PANNEL_DETECT_0
Crystal
TBD : (LVDS BackLight Inverter) 0101 1000
TYPE
ICH8-M
72h Ambient Light Sensor
USAGE
Crystal
Aux Display
AD22
MICOM
Crystal
DT PCI SLOT
(TBD)
Cardbus Controller
HD Audio
ASSIGNED TO
PCIE x1 Slot
Audio
Crystal
1
2
LAN
Crystal
4
5
CLOCK-Generator
27MHz (TBD)
GLAN
GLAN
Crystal
REVISION HISTORY
SUN XIAO,
WU SHIJIANG,
BYEONGCHANG LEE,
2/27/2008
PV
1.0
May 08, 2008 19:01:59 PM
BA41-####A
3 23
Gevena 2 ext
BOARD INFO
See rev notes for more information.
6
7
1101 110x
0100 1100
Thermal Sensor
-