Samsung MAX-852P, Service Manual

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4301-000116 BATTERY-LI;1.5V,500MA,AAA,10.2X44MM,-
AH26-80142X TRANS-POWER;EI85.8X57,115/230V,50/60Hz,M
0AH39-10002N POWER CORD;EP2,SPT-1#2/18,2.0M,5239,UL/C
AH90-10738N ASSY-MAIN PCB;MAX870,DOM S.N.A
AH93-10006G ASSY-MAIN,MANU;MAX870,MAIN MANU DOM
S.N.A
AC4 2401-000375 C-AL;100UF,5%,100V,GP,TP,10X20,5MM
AC5 2401-000375 C-AL;100UF,5%,100V,GP,TP,10X20,5MM
AIC1 1201-001218 IC-POWER AMP;417,SIP,22P,-,DUAL,40DB,PLA
AIC1 AH62-32001A HEAT SINK-M;-,AL,-,T6,-,-,-,MAX853V
AJ1 3716-000209 TERMINAL-BLOCK;,-,-,60V,7A
AJ2 3711-000820 CONNECTOR-HEADER;BOX,2P,1R,2.5MM,STRAIGH
BPF1L AH26-10001A TRANS-IF;FV-AD-BASE19K/38K,LOW PASS FILT
BPF1R AH26-10001A TRANS-IF;FV-AD-BASE19K/38K,LOW PASS FILT
DIC2 1205-000529 IC-SWITCH;LC4966,DIP,14P,-,-,40V,300MW,-
DX1 2802-000158 RESONATOR-CERAMIC;4MHZ,0.5%,TP,10.0X5.0X
FAN AH31-10020A FAN-DC;D0620B-12M,12VDC/0.16A,
FIC2 1204-001281 IC-AUDIO PROCESSOR;TDA7439,DIP,30P,400MI
FJ1 3711-003771 CONNECTOR-HEADER;2WALL,32P,1R,1.25mm,ANG
FJ2 3711-003735 CONNECTOR-HEADER;BOX,20P,2R,2.54MM,ANGLE
HJ1 3722-000363 JACK-PHONE;9P,6.4MM,AU,BLK,-
IFE1 AH40-10001U TUNER;FE337-A05,-,75OHM
RBD1 0402-001010 DIODE-BRIDGE;GBU6D,200V,6A,SIP-4
RBD12 AH62-30127A HEAT SINK-TR;-,AL,-,T2.0,-,WHT,-,MAX870
RBD2 0402-001010 DIODE-BRIDGE;GBU6D,200V,6A,SIP-4
RC10 2401-001942 C-AL;3300UF,20%,35V,GP,BK,18X35.5MM
RC15 2401-000375 C-AL;100UF,5%,100V,GP,TP,10X20,5MM
RC7 2401-003267 C-AL;4700UF,20%,80V,GP,BK,30X40,10
RC8 2401-003267 C-AL;4700UF,20%,80V,GP,BK,30X40,10
RC9 2401-001942 C-AL;3300UF,20%,35V,GP,BK,18X35.5MM
RIC2 1203-000276 IC-POSI.FIXED REG.;7805,TO-220,3P,-,PLAS
RIC2 AH62-30060A HEAT SINK-CD;AL,-,T1.0,-,-,-,SCM-7000,-
RIC3 1203-000110 IC-NEGA.FIXED REG.;7912,TO-220,3P,-,PLAS
RIC3 AH62-30060A HEAT SINK-CD;AL,-,T1.0,-,-,-,SCM-7000,-
RIC5 1203-000242 IC-POSI.FIXED REG.;7812,TO-220,3P,-,PLAS
RQ1 0502-000425 TR-POWER;2SD2395-F,NPN,2W,TO-220FN,BK,1
RQ11 0502-000303 TR-POWER;KSD882,NPN,1W,TO-126,TP,160-32
RQ2 0502-000424 TR-POWER;2SB1566-F,PNP,2W,TO-220FN,BK,1
RQ3 0502-000425 TR-POWER;2SD2395-F,NPN,2W,TO-220FN,BK,1
RQ6 0502-000424 TR-POWER;2SB1566-F,PNP,2W,TO-220FN,BK,1
RR14 13954-100-310 CERAMIC-PIPE;PI1.4 15MM WHT
RR14 2003-000314 R-METAL OXIDE;47OHM,5%,2W,AE,TP,6X16MM
RR18 13954-100-310 CERAMIC-PIPE;PI1.4 15MM WHT
RR18 2003-000473 R-METAL OXIDE(S);10OHM,5%,3W,AA,TP,6X16M
RWA1 AH39-20560P LEAD CONNECTOR-ASSY;-,5264,51088,8p,300m
TFL1 2903-000105 FILTER-CERAMIC;BP,10.7MHZ+-25KHZ,
TFL3 2903-000105 FILTER-CERAMIC;BP,10.7MHZ+-25KHZ,
TFL4 2903-000148 FILTER-CERAMIC;BP,-1KHZ,-,6DB,-,B
TIC1 AH14-10007H IC;LA1836,DIP,STICK IF+MPX
TIC2 AH14-10007G IC;LC72131,DIP,STICK PLL
TJ2 3716-000201 TERMINAL-BLOCK;NON SOLDER,4P,4MM,-,
TL1 AH27-80060A COIL-OSC;RBW07VB,345UH,AM+RF
TL2 AH26-10001E TRANS-IF;KS940228-09,-,-,7.6X12.0,-,450K
TL3 AH26-10020A TRANS-DET;-,7KLL,DET,-,7.8MM,91PF,11.32M
TX1 2802-000215 RESONATOR-CERAMIC;19KHZ,+-38HZ,-,7.0X3.5
TX2 2801-003152 CRYSTAL-UNIT;7.2MHZ,20PPM,28-AAS,12PF,50
VJ1 3722-000377 JACK-RCA;4P/2C,3.5MM,SN,BLK,#16~22
VWA1 3711-002809 CONNECTOR-HEADER;BOX,8P,1R,2MM,STRAIGHT,
AH93-20003U ASSY-MAIN,CHIP;MAX870,MAIN,CHIP DOM S.N.A
AC1 2203-000609 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,2012,
AC2L 2203-001640 C-CERAMIC,CHIP;390PF,10%,50V,X7R,TP,1608
AC2R 2203-001640 C-CERAMIC,CHIP;390PF,10%,50V,X7R,TP,1608
AR16R 2007-000686 R-CHIP;3.3Kohm,5%,1/10W,DA,TP,2012
AR22 2007-000941 R-CHIP;47Kohm,5%,1/10W,DA,TP,2012
AR23 2007-000493 R-CHIP;2.2Kohm,5%,1/10W,DA,TP,2012
AR2L 2007-000282 R-CHIP;100Kohm,5%,1/10W,DA,TP,2012
AR2R 2007-000282 R-CHIP;100Kohm,5%,1/10W,DA,TP,2012
AR3R 2007-000468 R-CHIP;1Kohm,5%,1/10W,DA,TP,2012
AR4R 2007-001039 R-CHIP;56Kohm,5%,1/10W,DA,TP,2012
AR5L 2007-000241 R-CHIP;1.5Kohm,5%,1/10W,DA,TP,2012
AR5R 2007-000241 R-CHIP;1.5Kohm,5%,1/10W,DA,TP,2012
AR9 2007-001208 R-CHIP;82Kohm,5%,1/10W,DA,TP,2012
AR9R 2007-000686 R-CHIP;3.3Kohm,5%,1/10W,DA,TP,2012
D1C4 1201-000163 IC-OP AMP;4560,SOP,8P,150MIL,DUAL,100V/M
D1C5 1201-000163 IC-OP AMP;4560,SOP,8P,150MIL,DUAL,100V/M
DC11 2203-000953 C-CERAMIC,CHIP;470pF,5%,50V,NPO,TP,2012,
DC17 2203-001550 C-CERAMIC,CHIP;1.2NF,10%,50V,X7R,TP,2012
DC18 2203-001143 C-CERAMIC ;68nF,10%,50V,X7R,2012,2mm,TP
DC19 2203-000495 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,2012
DC2 2203-000892 C-CERAMIC,CHIP;4.7nF,10%,50V,X7R,TP,2012
DC20 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012,
DC21 2203-000199 C-CERAMIC,CHIP;100nF,+80-20%,50V,Z5U,TP,
DC22 2203-000919 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
DC24 2203-001524 C-CERAMIC,CHIP;47pF,5%,50V,NPO,TP,2012,-
DC25 2203-001524 C-CERAMIC,CHIP;47pF,5%,50V,NPO,TP,2012,-
DC26 2203-000260 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,2012,
DC27 2203-000495 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,2012
DC28 2203-000199 C-CERAMIC,CHIP;100nF,+80-20%,50V,Z5U,TP,
DC29 2203-000919 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
DC32 2203-000363 C-CERAMIC,CHIP;150pF,5%,50V,NPO,TP,2012,
DC33 2203-000363 C-CERAMIC,CHIP;150pF,5%,50V,NPO,TP,2012,
DC8 2203-000661 C-CERAMIC,CHIP;270pF,5%,50V,NPO,TP,2012,
DC9 2203-000661 C-CERAMIC,CHIP;270pF,5%,50V,NPO,TP,2012,
DIC1 AH14-10007E IC;M65846FP,SOP,STICK DSP/ECHO
DIC3 1201-000463 IC-OP AMP;074,SOP,14P,196MIL,SINGLE,88DB
DR0 2007-000941 R-CHIP;47Kohm,5%,1/10W,DA,TP,2012
DR1 2007-000941 R-CHIP;47Kohm,5%,1/10W,DA,TP,2012
DR11 2007-000710 R-CHIP;3.9Kohm,5%,1/10W,DA,TP,2012
DR13 2007-000586 R-CHIP;22Kohm,5%,1/10W,DA,TP,2012
DR14 2007-001208 R-CHIP;82Kohm,5%,1/10W,DA,TP,2012
DR15 2007-000241 R-CHIP;1.5Kohm,5%,1/10W,DA,TP,2012
DR16 2007-001208 R-CHIP;82Kohm,5%,1/10W,DA,TP,2012
DR17 2007-000338 R-CHIP;120Kohm,5%,1/10W,DA,TP,2012
DR19 2007-000001 R-CHIP;68Kohm,5%,1/10W,DA,TP,2012
DR2 2007-000941 R-CHIP;47Kohm,5%,1/10W,DA,TP,2012
DR23 2007-000468 R-CHIP;1Kohm,5%,1/10W,DA,TP,2012
DR24 2007-000774 R-CHIP;33Kohm,5%,1/10W,DA,TP,2012
DR25 2007-001028 R-CHIP;560ohm,1%,1/10W,DA,TP,2012
DR26 2007-000409 R-CHIP;15Kohm,5%,1/10W,DA,TP,2012
DR29 2007-000774 R-CHIP;33Kohm,5%,1/10W,DA,TP,2012
Electrical Parts List
Location no. Code no. Description & Specifiation Remarks Location no. Code no. Description & Specifiation Remarks
Samsung Electronics 8-1
8. Electrical Parts List