Samsung HPR4272X/XAC, Service Manual

Page: 105 / 128

Circuit Description
Samsung Electronics 13-17
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A name of main part of Logic Board and vocabulary.
Item Name
Description
①
LVDS Connector
The connector to receive the RGB, H, V, DATAEN and DCLK signals that have been LVDS encoded through the
main board.
②
Y Connector The connector to output the control signal for the Y drive board.
③
X Connector The connector to output the control signal for the X drive board.
④
E-Buffer board Connector The connector to output the address data and the control signal to the E-buffer board.
⑤
F-Buffer board Connector The connector to output the address data and the control signal to the F-buffer board.
⑥
Power Connector The connector to receive power (5V, 3.3V) for the Logic board.
⑦
ASIC CHIP The main processor that generates and outputs the logic drive signal and the address data.
⑧
MICOM LOADING 5PIN CONNECTOR
(Debug only)
The connector to load the Micom drive program. The program is loaded by connecting to the GA-WRITER.
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About Logic Board
The Logic Board consists of a Logic Main board, which processes the main signal input through LVDS and creates the address
driver output and X,Y drive signals, and a Buffer board, which buffers the output signal and outputs the signal to the Address Driver
IC (TCP IC).
Logic Board Function Remark
Logic Main
- Video Signal Processing (W/L, error diffusion, APC)
- Outputs the Address Driver Control and Data Signals to the Buffer board.
- Outputs the XY Drive Board Control Signal
Buffer Board
Lower E Buffer board Outputs data and controls signals to the bottom left TCP IC.
Lower F Buffer board Outputs data and controls signals to the bottom right TCP IC.