October 2009
General Information
DDR3 SDRAM
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
96Ball FBGA for 1Gb E-die (x16)
A
B
C
D
E
F
G
H
M
N
7.50
±
0.10
0.
80 x
12
=
9.
60
0.80 x 8 = 6.40
3.20
0.80
4.
80
78 -
∅
0.45 Solder ball
0.2
A B
M
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11
.0
0
±
0.
10
J
K
L
0.
80
0.
80
(Post Reflow
∅
0.05
±
0.05)
(0.95)
(1.90)
Bottom
Top
Bottom
Top
#A1
7.50
±
0.10
11
.00
±
0.
10
0.
1
0M
A
X
0.
50
±
0.
05
1.10
±
0.10
0.35
±
0.05
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
7.50
±
0.10
6.
00
(Datum B)
(Datum A)
#A1 INDEX MARK
13
.3
0
±
0.
10
K
0.
80 x
15
=
12.
00
B
A
0.
80
0.
40
96 -
∅
0.45 Solder ball
0.2
A B
M
MOLDING AREA
(Post Reflow
∅
0.05
±
0.05)
(0.95)
(1.90)
#A1
7.50
±
0.10
13.
30
±
0.
1
0
0.
10MAX
0.
50
±
0.
05
1.10
±
0.10
0.35
±
0.05
8 7 6 5 4 3 2 1
9
0.80 x 8 = 6.40
3.20
0.80 1.60
8 7 6 5 4 3 2 1
9
