1. Precautions
1.3. ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD devices are
integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power
to the unit under test.
2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4) Use only an anti-static solder removal devices. Some solder removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ESD devices.
5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.
6) Do not remove a replacement ESD device from its protective package until immediately before installing it. (Most
replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).
7) Immediately before removing the protective materials from the leads of a replacement ESD device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
CAUTION
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8) Minimize body motions when handling unpackaged replacement ESD devices.
(Otherwise harmless motions such as the brushing together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity sufficient to damage an ESD device).
1-4
Copyright© 1995-2011 SAMSUNG. All rights reserved.
Summary of Contents for BD-D5250C
Page 10: ...5 Wiring Diagram 5 2 Main PCB 5 2 Copyright 1995 2011 SAMSUNG All rights reserved ...
Page 11: ...5 Wiring Diagram Copyright 1995 2011 SAMSUNG All rights reserved 5 3 ...
Page 12: ...5 Wiring Diagram 5 3 S M P S PCB 5 4 Copyright 1995 2011 SAMSUNG All rights reserved ...
Page 13: ...5 Wiring Diagram Copyright 1995 2011 SAMSUNG All rights reserved 5 5 ...
Page 14: ...5 Wiring Diagram 5 4 Front PCB 5 6 Copyright 1995 2011 SAMSUNG All rights reserved ...
Page 15: ...5 Wiring Diagram 5 5 USB PCB Copyright 1995 2011 SAMSUNG All rights reserved 5 7 ...
Page 16: ...5 Wiring Diagram 5 6 ITO 5 8 Copyright 1995 2011 SAMSUNG All rights reserved ...
Page 30: ...2 Product Specification Copyright 1995 2011 SAMSUNG All rights reserved 2 9 ...
Page 39: ...6 Schematic Diagrams 6 8 Copyright 1995 2011 SAMSUNG All rights reserved ...
Page 40: ...6 Schematic Diagrams 6 5 HDMI Main PCB Copyright 1995 2011 SAMSUNG All rights reserved 6 9 ...
Page 51: ...6 Schematic Diagrams 6 16 Core Front PCB 6 20 Copyright 1995 2011 SAMSUNG All rights reserved ...
Page 53: ...4 Trouble Shooting 4 2 Copyright 1995 2011 SAMSUNG All rights reserved ...
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