1. Precaution
1.2. Safety Precautions
1)
EMI
This device has been registered regarding EMI for residential use. It can be used in all areas.
2)
Circuit Test (Logic Test) Precautions
The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS. Since
these types of devices are highly susceptible to static electricity or current leakage, an isolation break may be caused.
Therefore read and follow the instructions below.
a) When handling an LSI or MSI, make sure your body is grounded through a few mega-ohms of resistance. In
addition, wear gloves and a jacket made of cotton and not of synthetic fibers that easily generate static electricity.
b) When repairing the product, place a conductive material (e.g. aluminum foil) grounded to the earth on the worktable.
c) You must use a soldering iron without a leakage current.
d) Do not touch the pin of an IC and carefully insert the IC into the black plastic package.
e) When inserting an IC into a PCB, be careful with the direction of the IC. When installing an IC in the wrong
direction, it might become damaged.
f) When carrying an IC, package the IC with conducting material such as aluminum foil or conducting sponge so as to
keep the voltage level of each of the terminals the same.
g) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
h) Since the storage temperature of an IC is between -20 ~ +70 degrees, keep it at room temperature, if possible.
i) When soldering an IC, solder it in as short a time as possible so that unnecessary heat is not applied to the device.
j) Avoid leaving excessive amounts of flux within a custom IC or between the pins when soldering a custom IC.
k) Take care to not damage the board when installing or separating an Option Board.
l) Take care to not break the printed circuit pattern on the PCB when separate an IC.
1-2
Copyright© 1995-2012 SAMSUNG. All rights reserved.
Summary of Contents for 70G7C
Page 8: ...2 Introduction 2 2 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 16: ...2 Introduction 2 4 Option part List 2 10 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 17: ...2 Introduction Copyright 1995 2012 SAMSUNG All rights reserved 2 11 ...
Page 18: ...2 Introduction 2 12 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 22: ...2 Introduction Jog Dial 2 16 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 23: ...2 Introduction Using 3D Copyright 1995 2012 SAMSUNG All rights reserved 2 17 ...
Page 24: ...2 Introduction 2 18 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 25: ...2 Introduction 3D glassed Copyright 1995 2012 SAMSUNG All rights reserved 2 19 ...
Page 28: ...2 Introduction NEW H W Platform 2 22 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 29: ...2 Introduction Copyright 1995 2012 SAMSUNG All rights reserved 2 23 ...
Page 32: ...2 Introduction H W BT 2 26 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 33: ...2 Introduction H W USB 3 0 Copyright 1995 2012 SAMSUNG All rights reserved 2 27 ...
Page 45: ...2 Introduction Copyright 1995 2012 SAMSUNG All rights reserved 2 39 ...
Page 52: ...4 Trouble shooting 4 3 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 53: ...4 Trouble shooting Copyright 1995 2012 SAMSUNG All rights reserved 4 4 ...
Page 66: ...4 Trouble shooting 4 6 RTC Battery Reset 4 17 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 69: ...4 Trouble shooting Copyright 1995 2012 SAMSUNG All rights reserved 4 20 ...
Page 74: ...4 Trouble shooting 4 10 H W Upgrade HDD 4 25 Copyright 1995 2012 SAMSUNG All rights reserved ...
Page 75: ...4 Trouble shooting Memory Copyright 1995 2012 SAMSUNG All rights reserved 4 26 ...
Page 77: ...5 System Wire Diagram Copyright 1995 2012 SAMSUNG All rights reserved 5 2 ...
Page 78: ...5 System Wire Diagram 5 3 Copyright 1995 2012 SAMSUNG All rights reserved ...