Hardware Installation and Reference Guide Preparation before Installation
Table 2-1 Temperature and Humidity Requirements
Temperature
Relative Humidity
0ºC to 50ºC (32ºF to 122ºF)
10% to 90% RH
The requirements for the sampling site of the temperature and humidity in the operating environment of the device
are as follows:
There is no protective plate at the front or back of the equipment rack.
The vertical height is 1.5 m above the floor.
The distance from the front panel of the equipment is 0.4 m.
2.2.3 Cleanness Requirements
Dust poses a severe threat to the running of the equipment. The indoor dust falling on the equipment may be adhered
by the static electricity, causing bad contact of the metallic joint. Such electrostatic adherence may occur more easily
when the relative humidity is low, not only affecting the useful life of the equipment, but also causing communication
faults. Table 2-2 shows the requirements for the dust content and granularity in the equipment room.
Table 2-2 Requirements for the Dust Content and Granularity in the Equipment Room
Substance
Concentration Limit (particles/m3)
Dust particles (diameter
≥
0.5
μ
m)
≤
3.5
×
10
6
Dust particles (diameter
≥
5
μ
m)
≤
3
×
10
4
Apart from dust, the salt, acid and sulfide in the air in the equipment room must also meet strict requirements; as such
poisonous substances may accelerate the corrosion of the metal and the aging of some parts. The equipment room
should be protected from the intrusion of harmful gases (for example, SO
2
, H
2
S, NO
2
and Cl
2
), whose requirements are
listed in the following table.
Table 2-3 Requirements for Harmful Gases in the Equipment Room
Gas
Average (mg/m3)
Maximum (mg/m3)
SO
2
0.3
1.0
H
2
S
0.1
0.5
NO
2
0.5
1.0
Cl
2
0.1
0.3
The
Average
refers to the average limit of harmful gas in one week. The
Maximum
value is the upper limit of the
harmful gas measured in one week for up to 30 minutes every day.
2.2.4 EMI
During applications, the switch may be subject to external interferences that affect the device through conduction
manners such as capacitance coupling, inductive coupling, electromagnetic wave emission, common impedance
