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ML7436N LSI Hardware Design Manual 

 

FEXL7436NDG-01 

ii 

NOTES 

 

1)

 

The information contained herein is subject to change without notice.   

 

2)

 

When  using  LAPIS  Technology  Products,  refer  to  the  latest  product  information  (data  sheets,  user’s  manuals, 
application  notes,  etc.),  and  ensure  that  usage  conditions  (absolute  maximum  ratings,  recommended  operating 
conditions,  etc.)  are  within  the  ranges  specified.  LAPIS  Technology  disclaims  any  and  all  liability  for  any 
malfunctions, failure or accident arising out of or in connection with the use of LAPIS Technology Products outside 
of  such  usage  conditions  specified  ranges,  or  without  observing  precautions.

 

Even  if  it  is  used  within  such  usage 

conditions specified  ranges,  semiconductors can  break down  and  malfunction  due  to  various factors.

 

Therefore,  in 

order  to  prevent  personal  injury,  fire  or  the  other  damage  from  break  down  or  malfunction  of  LAPIS  Technology 
Products,  please  take  safety  at  your  own  risk  measures  such  as  complying  with  the  derating  characteristics, 
implementing  redundant  and  fire  prevention  designs,  and  utilizing  backups  and  fail-safe  procedures.  You  are 
responsible for evaluating the safety of the final products or systems manufactured by you. 

 

3)

 

Descriptions of circuits, software and other related information in this document are provided only to illustrate the 
standard  operation  of  semiconductor  products  and  application  examples.

 

You  are  fully  responsible  for  the 

incorporation or any other use of the circuits, software, and information in the design of your product or system.

 

And 

the peripheral conditions must be taken into account when designing circuits for mass production.

 

LAPIS Technology 

disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these 
circuits, software, and other related information. 

 

4)

 

No  license,  expressly  or  implied,  is granted  hereby under  any  intellectual  property rights or  other  rights of  LAPIS 
Technology  or  any  third  party  with  respect  to  LAPIS  Technology  Products  or  the  information  contained  in  this 
document  (including  but  not  limited  to,  the  Product  data,  drawings,  charts,  programs,  algorithms,  and  application 
examples

etc.). Therefore LAPIS Technology shall have no responsibility whatsoever for any dispute, concerning 

such rights owned by third parties, arising out of the use of such technical information. 

 

5)

 

The  Products  are  intended  for  use  in  general  electronic  equipment  (AV/OA  devices,  communication,  consumer 
systems,  gaming/entertainment  sets,  etc.)  as  well  as  the  applications  indicated  in  this  document.

 

For  use  of  our 

Products  in  applications  requiring  a  high  degree  of  reliability  (as  exemplified  below),  please  be  sure  to  contact  a 
LAPIS Technology  representative  and  must  obtain written  agreement:  transportation  equipment  (cars, ships,  trains, 
etc.),  primary  communication  equipment,  traffic  lights,  fire/crime  prevention,  safety  equipment,  medical  systems, 
servers, solar cells, and power transmission systems, etc.

 

LAPIS Technology disclaims any and all liability for any 

losses and damages incurred by you or third parties arising by using the Product for purposes not intended by us. Do 
not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power 
control systems, and submarine repeaters, etc. 

 

6)

 

The Products specified in this document are not designed to be radiation tolerant. 

 

7)

 

LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. 
However, LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have 
no responsibility for any damages arising from any inaccuracy or misprint of such information. 

 

8)

 

Please  use  the  Products  in  accordance  with  any  applicable  environmental  laws  and  regulations,  such  as  the  RoHS 
Directive. LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with 
any applicable laws or regulations. 

 

9)

 

When  providing  our  Products  and  technologies  contained  in  this  document  to  other  countries,  you  must  abide  by  the 
procedures  and  provisions  stipulated  in  all  applicable  export  laws  and  regulations,  including  without  limitation  the  US 

Summary of Contents for LAPIS ML7436N

Page 1: ...ML7436N LSI Hardware Design Manual Issue Date Jan 19th 2021 FEXL7436NDG 01...

Page 2: ...Technology Products or the information contained in this document including but not limited to the Product data drawings charts programs algorithms and application examples etc Therefore LAPIS Technol...

Page 3: ...s regarding the information contained in this document or LAPIS Technology s Products 11 This document in part or in whole may not be reprinted or reproduced without prior consent of LAPIS Technology...

Page 4: ...ML7436N devices Hereafter ML7436N And also contains the measurement conditions and example of measurement results of RF characteristics Target product ML7436N The following related manual is availabl...

Page 5: ...wercase 103 1000 Milli m 10 3 Micro 10 6 Nano n 10 9 Second s lowercase Second Terminology H level Signal level on the high voltage side indicates the voltage level of VIH and VOH as defined in electr...

Page 6: ...7 1 2 Adjustment of LNA input impedance real part to 50 15 7 1 3 Adjustment of LNA input impedance imaginary part to 0 16 7 1 4 Connection to antenna 17 7 1 5 Reception matching value 17 7 2 SubGHz t...

Page 7: ...ltilayer ceramic capacitor to the RF_VBG 28 pin to reduce the noise from the band gap reference circuit 2 Crystal Oscillator circuit Figure 2 1 shows a configuration example of the crystal oscillator...

Page 8: ...oscillator circuit The capacitor s value of C1 C2 C3 and C4 depends on the crystal oscillator specification C1 C2 C3 and C4 should be placed as close as possible to the RF_XIN 1 the RF_XOUT 48 the CNI...

Page 9: ...applied to the RF_XOUT 48 pin A 100pF capacitor should be placed on the TCXO line as followingFigure 3 1 In ML7436N RF_XIN 1 pins is N C pin then it should be open It is necessary to turn TCXO off to...

Page 10: ...tions 5 Internal ADC ML7436N integrates a internal capacitor 20pF Typ that holds electric charge by ADC0 input voltage Connect more than 0 22uF capacitor when DC voltage level is measured with AD conv...

Page 11: ...ving transmission circuit as reference can maximize the power efficiency of transmission circuit Table 7 1 is the Measured RF impedance of each RF pins Table 7 1 Measured RF impedance of each RF pins...

Page 12: ...filter is adopted to remove the interfering wave At the transmission circuit DC voltage is biased at RF_REG_PA 32 pin through the choke coil of RF_PA_OUT1 33 pin It composes LPF Low Pass Filter and t...

Page 13: ...e Figure 7 2 is the measured value of the input impedance at RF_LNA_IN1 35 pin Figure 7 2 Measured input impedance The input impedance at the RF_LNA_IN1 35 can be expressed by the equivalent circuit t...

Page 14: ...of coupling capacitor Figure 7 4 shows that the connection of enough AC coupling capacitor Cac 100pF is connected to RF_LNA_IN1 pin RF_LNA_IN1 pin is biased to the stable DC voltage by the internal ci...

Page 15: ...f LNA input impedance real part to 50 Figure 7 5 shows the inductor Lmatch parallel connection It adjusts the LNA input impedance real part to 50 Figure 7 5 Addition of Lmatch The required inductance...

Page 16: ...lues convert input impedances to 1 50 jX 2 50 jX In case of 2 50 jX Lmatch is too large value it is difficult to adjust Lmatch value LAPIS technology recommends adopting 1 50 jX 7 1 3 Adjustment of LN...

Page 17: ...on 7 1 4 Connection to antenna Figure 7 9 shows the connection between antenna and the matching circuit The characteristic impedance is 50 Figure 7 9 Addition of the characteristic impedance 50 line 7...

Page 18: ...igher harmonics with T or type Chebyshev LPF Cz Lz Cz Figure 7 10 The cutoff frequency is approximately 1 5 times of the transmission frequency the ripple of passband is approximately 0 5dB the order...

Page 19: ...9 3 9 100 4 3 6 8 2 7 2 7 7 3 2 4GHz RF matching development procedure Figure 7 12 shows the example of the 2 4GHz RF matching circuit configuration The trap filter is configured to suppress the high...

Page 20: ...nics It is required to decide the maximum value of the higher harmonics and adjust the values meeting standards If necessary the trap filters are added to suppress every higher harmonic 7 3 2 Addition...

Page 21: ...dance is not 50 because the transmission character is prioritized over the reception character LAPIS technology tests the circuit with this impedance on the mass production process and confirm the min...

Page 22: ...with the trap filter suppressing the second the third harmonics and the matching circuit converting antenna load impedance to 50 Table 7 5 shows the matching circuit value Figure 7 16 2 4GHz RF match...

Page 23: ...pedance 50 8 2 Inductors Use inductors with high Q It is recommended to use LQW03AW series manufactured by Murata Manufacturing Co Ltd or equivalent Use inductors for the switching regulators that DC...

Page 24: ...D impedance Almost of L2 layer should be GND plane for double layerd board Figure 9 1 shows the ML7436N package figure The IC s back side GND PAD floats on the board The distance is 0 25mm Adjust the...

Page 25: ...o minimize the large current loop Mount inductor and capacitor close to IC and connect them with low impedance Mount the inductor L1 of the switching regulator and the transmission choke inductor L4 a...

Page 26: ...gn Fix REGPDIN 12 pin and TEST 39 pin to GND at the normal operation Fix RF_AMON 5 pin to OPEN When using TCXO fix RF_XIN 1 pin to OPEN Refer section 3 TCXO circuit When not using 2 4GHz band fix RF_L...

Page 27: ...ML7436N LSI Hardware Design Manual FEXL7436NDG 01 27 For DC DC For SubGHz band 420 440 860 870 920 930MHz For 2 4GHz band...

Page 28: ...GRM033 series 0603mm C19 1uF GRM033R61A105ME15E Murata Manufacturing GRM033 series 0603mm C20 100pF GRM0335C1H101JA01 Murata Manufacturing GRM033 series 0603mm C21 1 5pF GJM0335C1H1R5WB01 1 1pF GJM033...

Page 29: ...ML7436N LSI Hardware Design Manual FEXL7436NDG 01 29 Revision history Document No Date Page Content Previous New FEXL7436NDG 01 2021 1 19 The first edition...

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