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Rockwell Automation Publication 2198-UM001D-EN-P - May 2014
Chapter 5
Connecting the Kinetix 5500 Drive System
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 40 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to
.
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground