RF-BM-BG22A
Shenzhen RF-star Technology Co., Ltd.
Page 15 of 19
6.
The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.5.2 Vulnerable Module
1.
Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
2.
Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3.
Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.5.3 High Bit Error Rate
1.
There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2.
The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3.
If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.6 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions
below:
1.
According to the anti-static measures, bare hands are not allowed to touch modules.
2.
Modules must be placed in anti- static areas.
3.
Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.7 Soldering and Reflow Condition
1.
Heating method: Conventional Convection or IR/convection.
2.
Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3.
Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4.
Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5.
Peak temperature: 245
℃
.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (T
min
)
100
℃
150
℃
