APPENDIX C CONNECTORS FOR TARGET CONNECTION
User’s Manual U14481EJ3V0UM
74
C.4 Soldering CSSOCKET (Main Enclosure Connector) to Target Board (FBGA Package)
(1) Apply cream solder to the BGA pad of the target board. The thickness of the cream solder on the pad should be
100 to 150
µ
m. Too thick cream solder may cause short-circuiting.
(2) On the part of CSSOCKET to be connected to LSPACK, protective tape (polyimide tape) is attached for protection
from flux splashing during reflow soldering. Do not remove this tape until reflow soldering is completed.
(3) Place CSSOCKET on the target board, with its guide pins inserted into the holes for the guides on the target
board, as shown in Figure C-5. Confirm that the pad on the board and CSSOCKET are correctly positioned.
(4) Mounting CSSOCKET
<1> The dimensions of CSSOCKET are the same as the actual IC package.
<2> Solder CSSOCKET at a temperature of 210
°
C or more and for 30 to 60 seconds, as indicated in the table
below.
<3> Table C-1 shows the recommended reflow conditions. Figure C-6 shows an example of the mounting
profile of CSSOCKET.
Table C-1. Recommended Reflow Conditions
Surface Temperature of CSSOCKET Connector
Preheating
150 to 180
°
C, 180 seconds
Heating 210
°
C or more, 30 to 60 seconds
(5) Remove the protective tape from the surface.
Figure C-5. Mounting of CSSOCKET on Target Board
CSSOCKET
Target board
Guide pin
Caution Do not clean CSSOCKET to remove flux.
