Quectel SC200E Series Manual Download

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Smart Module Series

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8.2. Recommended Footprint

Figure 42: Recommended Footprint (Top View)

Keep at least 3 mm between the module and other components on the motherboard to improve

soldering quality and maintenance convenience.

NOTE

Summary of Contents for SC200E Series

Page 1: ...SC200E Series Hardware Design Smart Module Series Version 1 0 Date 2022 04 22 Status Released ...

Page 2: ... we employ commercially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as available basis We may revise or restate this document from time to time at our sole discretion without any prior notice to you Use and Disclosure Restrictions License Agreements Documents and information ...

Page 3: ... To implement module functionality certain device data are uploaded to Quectel s or third party s servers including carriers chipset suppliers or customer designated servers Quectel strictly abiding by the relevant laws and regulations shall retain use disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws Before data interacti...

Page 4: ...ices may cause interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles operating over radio signal and cellular network cannot be guaranteed to connect in certain conditions such as when the mobile bill is unpaid or the U SIM card is invalid When emergent...

Page 5: ...C200E_Series_Hardware_Design 4 115 About the Document Revision History Version Date Author Description 2021 11 25 Dorian MENG Waller GUO Creation of the document 1 0 2022 04 22 Dorian MENG Waller GUO First official release ...

Page 6: ...wer Supply 36 3 4 1 Power Supply Pins 36 3 4 2 Voltage Stability Requirements 36 3 4 3 Reference Design for Power Supply 37 3 5 Turn On Off 38 3 5 1 Turn On with PWRKEY 38 3 5 2 Turn Off 40 3 6 VRTC 40 3 7 Power Output 41 3 8 Charging Interface 41 3 9 USB Interface Type C 43 3 10 UART Interfaces 45 3 11 U SIM Interfaces 47 3 12 SD Card Interface 49 3 13 GPIO Interfaces 51 3 14 I2C Interfaces 52 3 ...

Page 7: ...nna Interfaces 74 6 1 1 Operating Frequency 74 6 1 2 Reference Design 77 6 2 Wi Fi Bluetooth Antenna Interface 77 6 3 GNSS Antenna Interface 78 6 3 1 Reference Circuit Design for Passive GNSS Antenna 79 6 3 2 Reference Circuit Design for Active GNSS Antenna 80 6 4 RF Routing Guidelines 80 6 5 Antenna Installation 82 6 5 1 Antenna Requirements 82 6 5 2 RF Connector Recommendation 83 7 Reliability R...

Page 8: ...Series SC200E_Series_Hardware_Design 7 115 9 1 Storage Conditions 104 9 2 Manufacturing and Soldering 105 9 3 Packaging Specification 107 9 3 1 Plastic Reel 107 9 3 2 Packaging Process 108 10 Appendix References 109 ...

Page 9: ...9 Pin Definition of Motor Drive Interface 53 Table 20 Pin Definition of LCM Interface 54 Table 21 Pin Definition of Flash Interface 56 Table 22 Pin Definition of Touch Panel Interface 57 Table 23 Pin Definition of Camera Interfaces 58 Table 24 MIPI Trace Length Inside the Module 61 Table 25 Pin Definition of Sensor Interface 62 Table 26 Pin Definition of Audio Interfaces 63 Table 27 Pin Definition...

Page 10: ...umption 88 Table 51 SC200E EM Power Consumption 90 Table 52 SC200E NA Power Consumption 93 Table 53 SC200E CE RF Tx Power 94 Table 54 SC200E EM RF Tx Power 95 Table 55 SC200E NA RF Tx Power 96 Table 56 SC200E CE RF Rx Sensitivity 97 Table 57 SC200E EM RF Rx Sensitivity 97 Table 58 SC200E NA RF Rx Sensitivity 98 Table 59 Electrostatic Discharge Characteristics Temperature 25 ºC Humidity 45 99 Table...

Page 11: ...gure 21 Reference Circuit Design for the Touch Panel Interface 57 Figure 22 Reference Circuit Design for 3 Camera Applications 60 Figure 23 Reference Circuit Design for ECM Microphone Interface 64 Figure 24 Reference Circuit Design for MEMS Microphone Interface 64 Figure 25 Reference Circuit Design for Earpiece Interface 65 Figure 26 Reference Circuit Design for Headset Interface 65 Figure 27 Refe...

Page 12: ...2 Recommended Footprint Top View 102 Figure 43 Top and Bottom Views of the Module 103 Figure 44 Recommended Reflow Soldering Thermal Profile 105 Figure 45 Carrier Tape Dimension Drawing 107 Figure 46 Plastic Reel Dimension Drawing 107 Figure 47 Packaging Process 108 ...

Page 13: ...luding any applicable source based timeaveraging duty factor antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2 1091 2 The EUT is a mobile device maintain at least a 20 cm separation between the EUT and the user s body and must not transmit simultaneously with any other antenna or transmitter 3 A label with the following statements must be attached to the host end...

Page 14: ... an additional permanent label referring to the enclosed module Contains Transmitter Module FCC ID XMR2022SC200ENA or Contains FCC ID XMR2022SC200ENA must be used The host OEM user manual must also contain clear instructions on how end users can find and or access the module and the FCC ID The final host module combination may also need to be evaluated against the FCC Part 15B criteria for uninten...

Page 15: ...r l émetteur doit être installé pour fournir une distance de séparation d au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur The host product shall be properly labeled to identify the modules within the host product The Innovation Science and Economic Development Canada certification label of a module shall...

Page 16: ...isk is used after a function feature interface pin name AT command or argument it indicates that the function feature interface pin AT command or argument is under development and currently not supported and the asterisk after a model indicates that the sample of the model is currently unavailable ...

Page 17: ...multiple audio and video codecs Built in high performance AdrenoTM 702 graphics processing unit Provides multiple audio and video input output interfaces as well as abundant GPIO interfaces The module is available in four variants SC200E CE SC200E EM SC200E NA SC200E WF The following tables show the supported frequency bands and network standards of the module Table 2 SC200E CE Frequency Bands and...

Page 18: ... L1 Mode Frequency Bands LTE FDD B1 B2 B3 B4 B5 B7 B8 B20 B28 LTE TDD B38 B40 B41 WCDMA B1 B2 B4 B5 B8 GSM GSM850 EGSM900 DCS1800 PCS1900 Wi Fi 802 11a b g n ac 2402 2482 MHz 5180 5825 MHz Bluetooth 5 0 2402 2480 MHz GNSS GPS 1575 42 1 023 MHz L1 GLONASS 1597 5 1605 8 MHz L1 BDS 1561 098 2 046 MHz B1I Galileo 1575 42 2 046 MHz E1 QZSS 1575 42 1 023 MHz L1 SBAS 1575 42 1 023 MHz L1 Mode Frequency B...

Page 19: ...e digital signage alarm panel security and industry PDA etc 2 2 Key Features The following table describes the detailed features of the module Table 5 Key Features 1575 42 1 023 MHz L1 1176 45 10 23 MHz L5 GLONASS 1597 5 1605 8 MHz L1 BDS 1561 098 2 046 MHz B1I Galileo 1575 42 2 046 MHz E1 1176 45 10 23 MHz E5a QZSS 1575 42 1 023 MHz L1 1176 45 10 23 MHz L5 SBAS 1575 42 1 023 MHz L1 1176 45 10 23 ...

Page 20: ... CDMA BC0 Class 3 24 dBm 1 3 dB for WCDMA bands Class 3 23 dBm 2 dB for LTE FDD bands Class 3 23 dBm 2 dB for LTE TDD bands LTE Features SC200E CE EM NA Supports 3GPP Rel 10 Cat 4 Supports 1 4 3 5 10 15 20 MHz RF bandwidth Supports Multiuser MIMO in DL direction Data rate Max Cat 4 FDD 150 Mbps DL 50 Mbps UL Cat 4 TDD 130 Mbps DL 30 Mbps UL UMTS Features SC200E CE EM Supports 3GPP Rel 9 DC HSDPA H...

Page 21: ...L1 SC200E NA GPS GLONASS BDS Galileo QZSS SBAS NavIC L1 L5 SMS Text and PDU mode Point to point MO and MT SMS cell broadcast LCM Interface Supports one group of 4 lane MIPI DSI Supports up to HD 1680 720 60 fps Camera Interfaces Supports two groups of 4 lane MIPI CSI up to 2 5 Gbps lane Supports two cameras 4 lane 4 lane or three cameras 4 lane 2 lane 1 lane Supports up to 25 MP or 13 MP 13 MP wit...

Page 22: ... plug U SIM Interfaces Two U SIM interfaces Supports USIM SIM cards 1 8 2 95 V Supports Dual SIM Dual Standby supported by default I2C Interfaces Four I2C interfaces Used for peripherals such as camera sensor touch panel etc ADC Interface One generic ADC interface up to 15 bit resolution Real Time Clock Supported Antenna Interfaces SC200E CE EM NA Main antenna Rx diversity antenna GNSS antenna and...

Page 23: ...nd illustrates the major functional parts Power management Radio frequency Baseband LPDDR4X eMMC flash Peripheral interfaces Figure 1 Functional Diagram 2 4 EVB Kit To help you develop applications with the module conveniently Quectel supplies an evaluation board with accessories to control or to test the module For details see document 1 ...

Page 24: ...lowing interfaces and functions are described in detail in these subsequent chapters Power supply VRTC Power output Charging interface USB interface UART interfaces U SIM interfaces SD card interface GPIO interfaces I2C interfaces ADC interface Motor drive interface LCM interface Flash interface Touch panel interface Camera interfaces Sensor interface Audio interfaces USB_BOOT Interface ...

Page 25: ...LN2_P 60 DSI_LN3_N 61 DSI_LN3_P 62 GND 63 CSI1_CLK_N 64 CSI1_CLK_P 65 CSI1_LN0_N 66 CSI1_LN0_P 67 CSI1_LN1_N 68 CSI1_LN1_P 69 GND 70 CSI1_LN3_N 71 CSI1_LN3_P 72 CSI1_LN2_N 73 CSI1_LN2_P 186 CBL_ PWR_N 185 BAT_ID 184 VPH_ PWR 183 BAT_M 182 GPIO_ 86 181 NFC_ CLK 180 FLASH _LED 179 RESER VED 178 RESER VED 177 GPIO_ 112 147 MIC_ BIAS1 187 GND 222 GND 221 GND 220 GND 219 GND 218 GND 217 GND 216 GND 215...

Page 26: ... Description DC Characteristics Comment VBAT 1 2 145 146 PIO Power supply for the module Vmin 3 5 V Vnom 3 8 V Vmax 4 4 V Provide sufficient current up to 3 A It is suggested to use a TVS for surge protection VPH_PWR 184 PO Power supply for peripherals Vmin 3 5 V Vnom 3 8 V Vmax 4 4 V This pin is used to power peripheral devices Maximum output current is 1 A LDO15A_1V8 111 PO 1 8 V output Vnom 1 8...

Page 27: ...utput current is 3 mA MIC1_P 4 AI Microphone input for channel 1 MIC1_M 5 AI Microphone input for channel 1 MIC2_P 6 AI Microphone input for headset MIC3_P 148 AI Microphone input for channel 3 MIC3_M 149 AI Microphone input for channel 3 MIC_BIAS3 155 PO Bias voltage 3 output for microphone Vnom 1 8 V The rated output current is 3 mA The output voltage is fixed at 1 8 V and cannot be adjusted EAR...

Page 28: ...dard compliant USB_SS1_RX_M 270 AI USB 3 1 channel 1 superspeed receive USB_SS1_TX_P 254 AO USB 3 1 channel 1 superspeed transmit USB_SS1_TX_M 253 AO USB 3 1 channel 1 superspeed transmit USB_SS2_RX_P 152 AI USB 3 1 channel 2 superspeed receive USB_SS2_RX_M 192 AI USB 3 1 channel 2 superspeed receive USB_SS2_TX_P 150 AO USB 3 1 channel 2 superspeed transmit USB_SS2_TX_M 151 AO USB 3 1 channel 2 su...

Page 29: ...ported USIM2_DATA 20 DIO U SIM2 card data VILmax 0 2 USIM2_VDD VIHmin 0 7 USIM2_VDD VOLmax 0 4 V VOHmin 0 8 USIM2_VDD Cannot be multiplexed into a generic GPIO USIM2_CLK 19 DO U SIM2 card clock VOLmax 0 4 V VOHmin 0 8 USIM2_VDD USIM2_RST 18 DO U SIM2 card reset USIM2_DET 17 DI U SIM2 card hot plug detect VILmax 0 63 V VIHmin 1 17 V Active low Externally pull it up to 1 8 V If unused keep it open S...

Page 30: ... Name Pin No I O Description DC Characteristics Comment LCD_RST 49 DO LCD reset VOLmax 0 45 V VOHmin 1 35 V 1 8 V power domain LCD_TE 50 DI LCD tearing effect VILmax 0 63 V VIHmin 1 17 V DSI_CLK_N 52 AO LCD MIPI clock DSI_CLK_P 53 AO LCD MIPI clock DSI_LN0_N 54 AO LCD MIPI lane 0 data DSI_LN0_P 55 AO LCD MIPI lane 0 data DSI_LN1_N 56 AO LCD MIPI lane 1 data DSI_LN1_P 57 AO LCD MIPI lane 1 data DSI...

Page 31: ...LN0_P 197 AI MIPI CSI0 lane 0 data CSI0_LN1_N 159 AI MIPI CSI0 lane 1 data CSI0_LN1_P 198 AI MIPI CSI0 lane 1 data CSI0_LN2_N 160 AI MIPI CSI0 lane 2 data CSI0_LN2_P 199 AI MIPI CSI0 lane 2 data CSI0_LN3_N 161 AI MIPI CSI0 lane 3 data CSI0_LN3_P 200 AI MIPI CSI0 lane 3 data CAM0_I2C_SCL 83 OD I2C clock of camera 0 Need to be pulled up to 1 8 V externally Can only be used for camera I2C devices CAM...

Page 32: ... the module s charging status IImax 5 mA Keypad Interfaces Pin Name Pin No I O Description DC Characteristics Comment PWRKEY 114 DI Turn on off the module Pulled up to 1 1 V internally Active low VOL_UP 95 DI Volume up VILmax 0 63 V VIHmin 1 17 V If unused keep it open Cannot be externally pulled up 1 8 V power domain VOL_DOWN 96 DI Volume down VILmax 0 63 V VIHmin 1 17 V RESET_N 225 DI Reset the ...

Page 33: ...DC Characteristics Comment ANT_MAIN 87 AIO Main antenna interface 50 Ω impedance ANT_GNSS 121 AI GNSS antenna interface ANT_DRX 131 AI Diversity antenna interface ANT_WIFI BT 77 AIO Wi Fi Bluetooth antenna interface Antenna Tuner Control Interfaces Pin Name Pin No I O Description DC Characteristics Comment GRFC_13 173 DIO Generic RF controller Cannot be multiplexed into a generic GPIO Cannot be pu...

Page 34: ... 3 V IOmax 100 mA Connect it to the positive pole of the motor Other Interfaces Pin Name Pin No I O Description DC Characteristics Comment USB_BOOT 46 DI Force the module into emergency download mode Force the module to enter emergency download mode by pulling this pin up to LDO15A_1V8 when the module is turning on GNSS_LNA_EN 194 DO GNSS LNA enable control NFC_CLK 181 DO NFC clock The default out...

Page 35: ...ng on GPIO_58 113 DIO General purpose input output GPIO_60 123 DIO General purpose input output GPIO_86 182 DIO General purpose input output GPIO_112 177 DIO General purpose input output GPIO_111 267 DIO General purpose input output GPIO_98 265 DIO General purpose input output GPIO_99 105 DIO General purpose input output GPIO_100 264 DIO General purpose input output GPIO_101 239 DIO General purpos...

Page 36: ... DIO General purpose input output PMU_GPIO03 124 DIO General purpose input output PMU_GPIO04 115 DIO General purpose input output PMU_GPIO08 127 DIO General purpose input output PMU_GPIO07 201 DIO General purpose input output GND Pin Name Pin No GND 3 7 12 15 27 51 62 69 76 78 85 86 88 89 120 122 130 132 135 140 143 144 162 171 172 176 187 191 202 204 206 224 226 231 233 238 240 241 243 245 247 24...

Page 37: ...rops below 3 4 V Voltage 3 8 V 3 A Input current Figure 3 Voltage Drop Sample To decrease voltage drop use a bypass capacitor of about 100 µF with low ESR ESR 0 7 Ω and reserve a multi layer ceramic chip capacitor MLCC array due to its ultra low ESR It is recommended to use three ceramic capacitors 100 nF 33 pF 10 pF to compose the MLCC array and place these capacitors close to VBAT pins Additiona...

Page 38: ... the input and output is not too big use an LDO when supplying power to the module If there is a big voltage difference between the input source and the desired output VBAT a buck converter is recommended The following figure shows a reference design for 5 V input power source The typical output voltage is 3 8 V and the maximum load current is 5 0 A VCC_5V U1 PGND PGND PGND PVIN PVIN PVIN EN SS TR...

Page 39: ...he PWRKEY pin low for at least 1 6 s The PWRKEY pin is pulled up to 1 1 V internally It is recommended to use an open collector driver to control PWRKEY A simple reference circuit is illustrated in the following figure Turn on pulse PWRKEY 4 7K 47K 1 6s R1 R2 Q1 R3 1K Figure 6 Turn On the Module with Open Collector Driver Another way to control PWRKEY is by using a button directly You must place a...

Page 40: ...LDO17A_3V0 Active Note2 Software controlled Figure 8 Turn on Timing 1 When the module is turned on for the first time the turn on timing may be different from that shown above 2 Make sure that VBAT is stable before pulling down PWRKEY It is recommended to wait until VBAT is stable at 3 8 V for at least 30 ms before pulling down PWRKEY Additionally do not keep pulling PWRKEY down all the time NOTE ...

Page 41: ...n off Timing 3 6 VRTC The RTC Real Time Clock can be powered by an external power source through VRTC when the module is powered down and there is no power supplied to VBAT The external power source can be a rechargeable battery such as a coin cell according to application demands A reference circuit design is shown below Coin Cell Module RTC Core VRTC Figure 10 RTC Powered by Coin Cell If RTC is ...

Page 42: ...plied to the battery When the battery voltage is charged up and is between 2 1 V and 3 4 V the charging current can be set to 400 mA maximally Constant current mode CC mode When the battery is increased to 3 4 to 4 2 V the system will switch to CC mode The maximum charging current is 1 85 A when an adapter is used for battery charging and the maximum charging current is 450 mA for USB charging Con...

Page 43: ...T_P BAT_THERM VBAT 100 μF NTC VBAT 33 pF 4 7 μF ESD ESD 1 2 3 USB_VBUS Adapter or USB Module Battery BAT_M C1 C2 C3 D1 D2 C2 NM_1 nF C4 GND Figure 11 Reference Design for Battery Charging Circuit Mobile devices such as mobile phones or handheld POS systems are powered by batteries For different batteries you should modify the charging and discharging curve correspondingly to achieve the best perfo...

Page 44: ...eed differential channel USB_DP USB_DM and one USB 3 1 compliant superspeed differential channel USB_SS1_RX_P M USB_SS1_TX_P M and USB_SS2_RX_P M USB_SS2_TX_P M When Type C is plugged in with one side up the external device is detected by USB_CC1 and the data will be transmitted through USB_SS1 when it is plugged in with the other side up the external device is detected by USB_CC2 and the data wil...

Page 45: ...ically the capacitance value should be less than 2 pF for USB 2 0 and less than 0 5 pF for USB 3 1 Do not route signal traces under crystals oscillators magnetic devices or RF signal traces Route the USB differential traces in inner layer with ground shielding on not only the upper and lower layers but also the right and left sides Make sure the intra pair length difference within USB 2 0 differen...

Page 46: ...ports RTS and CTS hardware flow control UART4 debug UART two wire UART interface used for debugging by default UART1 two wire UART interface Table 12 Pin Definition of UART Interfaces Pin No Signal Length mm Length Difference DP DM 13 USB_DM 24 13 0 24 14 USB_DP 24 37 252 USB_SS1_RX_P 16 33 0 17 270 USB_SS1_RX_M 16 50 254 USB_SS1_TX_P 10 07 0 07 253 USB_SS1_TX_M 10 14 152 USB_SS2_RX_P 17 74 0 28 1...

Page 47: ...ection between the module and a PC It is recommended to add a level translator and an RS 232 level translator chip between the module and the PC RTS_3 3V RXD_3 3V CTS_3 3V TXD_3 3V RTS_1 8V RXD_1 8V CTS_1 8V TXD_1 8V VCCA Module GND GND 1 8 V VCCB 3 3 V DIN1 ROUT3 ROUT2 ROUT1 DIN4 DIN3 DIN2 DIN5 R1OUTB FORCEON FORCEOFF INVALID 3 3 V DOUT1 DOUT2 DOUT3 DOUT4 DOUT5 RIN3 RIN2 RIN1 VCC GND OE DB 9 RTS ...

Page 48: ...o I O Description Comment USIM1_VDD 26 PO U SIM1 card power supply Either 1 8 V or 2 95 V U SIM card is supported USIM1_DATA 25 DIO U SIM1 card data Cannot be multiplexed into a generic GPIO USIM1_CLK 24 DO U SIM1 card clock USIM1_RST 23 DO U SIM1 card reset USIM1_DET 22 DI U SIM1 card hot plug detect Active low Externally pull it up to 1 8 V If unused keep it open USIM2_VDD 21 PO U SIM2 card powe...

Page 49: ...ay 22 pF VCC RST CLK IO VPP GND USIM_VDD 10K Module R1 R2 C1 22 pF 22 pF C2 C3 C4 D1 22R 22R R3 R4 R5 Figure 15 Reference Circuit for U SIM Interface with an 8 pin U SIM Card Connector If you do not need hot plug detection keep USIM1_DET and USIM2_DET pins open The following is a reference circuit for U SIM interface with a 6 pin U SIM card connector when hot plug detection is not needed Module US...

Page 50: ...t exceeding 10 pF Add 22 Ω resistors in series between the module and U SIM card to suppress EMI such as spurious transmission Please note that the U SIM peripheral circuit should be close to the U SIM card connector Add 22 pF capacitors in parallel on USIM_DATA USIM_CLK and USIM_RST signal lines to filter RF interference and place them as close to the U SIM card connector as possible 3 12 SD Card...

Page 51: ...e high output current it is recommended that the trace width should be at least 0 8 mm To ensure output current stability add a 4 7 μF and a 33 pF capacitor in parallel near the SD card connector SD_CMD SD_CLK SD_DATA0 SD_DATA1 SD_DATA2 and SD_DATA3 are all high speed signal lines In PCB design control the characteristic impedance of them to 50 Ω and do not cross them with other traces It is recom...

Page 52: ...nput output GPIO_35 107 DIO General purpose input output GPIO_36 110 DIO General purpose input output GPIO_55 100 DIO General purpose input output GPIO_56 106 DIO General purpose input output GPIO_57 112 DIO General purpose input output Cannot be pulled up when the module is turning on GPIO_58 113 DIO General purpose input output GPIO_60 123 DIO General purpose input output GPIO_86 182 DIO General...

Page 53: ...2 104 DIO General purpose input output GPIO_103 103 DIO General purpose input output GPIO_104 101 DIO General purpose input output GPIO_105 102 DIO General purpose input output GPIO_106 90 DIO General purpose input output GPIO_107 98 DIO General purpose input output GPIO_14 118 DIO General purpose input output GPIO_15 119 DIO General purpose input output GPIO_16 116 DIO General purpose input outpu...

Page 54: ... 8 V externally Can be used for other I2C devices CAM0_I2C_SCL 83 OD I2C clock of camera 0 Can only be used for camera I2C devices CAM0_I2C_SDA 84 OD I2C data of camera 0 CAM1_I2C_SCL 166 OD I2C clock of camera 1 CAM1_I2C_SDA 205 OD I2C data of camera 1 SENSOR_I2C_SCL 91 OD I2C clock for external sensor Can only be used to for sensors SENSOR_I2C_SDA 92 OD I2C data for external sensor Pin Name Pin ...

Page 55: ...face The module provides one LCM interface which is MIPI DSI standard compliant The interface supports high speed differential data transmission and supports HD display 1680 720 60 fps The pin definition of the LCM interface is shown below Table 20 Pin Definition of LCM Interface Pin Name Pin No I O Description Comment LCD_RST 49 DO LCD reset 1 8 V power domain LCD_TE 50 DI LCD tearing effect DSI_...

Page 56: ...PI_TCP MIPI_TCN 29 28 30 3 4 5 6 3 4 5 6 3 4 5 6 3 4 5 6 DSI_LN1_N DSI_LN1_P DSI_LN0_N DSI_LN0_P 1 2 3 4 5 6 11 1 2 1 2 1 2 1 2 100 nF 4 7 μF 1 μF Module LCM FL1 FL2 FL3 FL4 FL5 EMI filter C3 C2 C1 NC GND GND GND GND ADC 31 32 33 34 DSI GND LDO_IOVDD NM LCM_2V8 OUT GND IN EN LDO VPH_PWR GPIO 1 μF C4 Figure 19 Reference Circuit Design for LCM Interface MIPI are high speed signal lines It is recomme...

Page 57: ...ou can design the external backlight driving circuit for LCM according to actual requirements A reference circuit design is shown in the following figure in which the PWM pin is used to adjust the backlight brightness LCM_LED PWM Module 2 2 μF Backlight driver LCM_LED VPH_PWR C1 R1 10K Figure 20 Reference Design for LCM External Backlight Driving Circuit 3 18 Flash Interface The module supports on...

Page 58: ...e circuit for the TP interface is shown below TP_RST TP_I2C_SCL TP_I2C_SDA TP_INT 1 2 3 4 5 6 2 2K 2 2K LDO15A_1V8 4 7 μF 100 nF Module RESET SCL SDA INT GND VDD TP R2 R1 C1 C2 D1 D2 D3 D4 D5 LDO17A_3V0 GND Figure 21 Reference Circuit Design for the Touch Panel Interface Pin Name Pin No I O Description Comment TP_RST 31 DO TP reset 1 8 V voltage domain Active low TP_INT 30 DI TP interrupt 1 8 V vo...

Page 59: ..._CLK_P 64 AI MIPI CSI1 clock CSI1_LN0_N 65 AI MIPI CSI1 lane 0 data CSI1_LN0_P 66 AI MIPI CSI1 lane 0 data CSI1_LN1_N 67 AI MIPI CSI1 lane 1 data CSI1_LN1_P 68 AI MIPI CSI1 lane 1 data CSI1_LN2_N 72 AI MIPI CSI1 lane 2 data CSI1_LN2_P 73 AI MIPI CSI1 lane 2 data CSI1_LN3_N 70 AI MIPI CSI1 lane 3 data CSI1_LN3_P 71 AI MIPI CSI1 lane 3 data CSI0_CLK_N 157 AI MIPI CSI0 clock CSI0_CLK_P 196 AI MIPI CS...

Page 60: ...mera 0 1 8 V power domain CAM1_PWDN 82 DO Power down of camera 1 CAM2_PWDN 163 DO Power down of camera 2 CAM0_MCLK 74 DO Master clock of camera 0 CAM1_MCLK 75 DO Master clock of camera 1 CAM2_MCLK 165 DO Master clock of camera 2 CAM0_RST 79 DO Reset of camera 0 CAM1_RST 81 DO Reset of camera 1 CAM2_RST 164 DO Reset of camera 2 CAM1_I2C_SCL 166 OD I2C clock of camera 1 Need to be pulled up to 1 8 V...

Page 61: ...I1_CLK_P CSI1_CLK_N LDO15A_1V8 2 2K 2 2K camera1 connector 1 μF 4 7 μF 4 7μF 1 μF 1 μ F 4 7μF CAM0_RST CAM2_PWDN CAM2_MCLK CAM1_I2C_SDA _ CAM1_I2C_SCL CAM2_RST camera2 connector AVDD DVDD DOVDD EMI EMI EMI EMI EMI EMI EMI EMI 1μF 2 2K 2 2K DVDD EMI EMI 4 7 1μF μF AVDD DOVDD OUT GND IN EN LDO VPH_PWR 1 μF AF_VDD OUT GND IN EN LDO VPH_PWR GPIO 1 μF VDD_2V8 GPIO OUT GND IN EN LDO 1 μF GPIO VPH_PWR Fi...

Page 62: ...he trace width among MIPI signal lines During impedance matching do not connect GND on different planes to ensure impedance consistency It is recommended to select a low capacitance TVS for ESD protection and the recommended parasitic capacitance should be below 1 pF Route MIPI traces according to the following rules a The total trace length should not exceed 240 mm b Control the differential impe...

Page 63: ...53 0 3 CSI1_LN2_P 73 19 23 CSI1_LN3_N 70 18 93 0 11 CSI1_LN3_P 71 18 82 CSI0_CLK_N 157 20 94 0 21 CSI0_CLK_P 196 20 73 CSI0_LN0_N 158 18 74 0 34 CSI0_LN0_P 197 18 40 CSI0_LN1_N 159 17 18 0 19 CSI0_LN1_P 198 17 37 CSI0_LN2_N 160 8 28 0 13 CSI0_LN2_P 199 8 15 CSI0_LN3_N 161 4 97 0 27 CSI0_LN3_P 200 4 70 Pin Name Pin No I O Description Comment SENSOR_I2C_SCL 91 OD I2C clock for external sensor Need t...

Page 64: ...ge 1 output for microphone The rated output current is 3 mA MIC1_P 4 AI Microphone input for channel 1 MIC1_M 5 AI Microphone input for channel 1 MIC2_P 6 AI Microphone input for headset MIC3_P 148 AI Microphone input for channel 3 MIC3_M 149 AI Microphone input for channel 3 MIC_BIAS3 155 PO Bias voltage 3 output for microphone The rated output current is 3 mA The output voltage is fixed to 1 8 V...

Page 65: ...1 Reference Circuit Design for Microphone Interfaces MIC1_P ECM MIC Module MIC1_M C2 C3 MIC_BIAS1 R3 R1 C1 R4 2 2K 0R 0R MIC1_P ECM MIC Module MIC1_M C2 C3 MIC_BIAS1 R3 R1 R2 C1 R4 2 2K 0R 0R 0R 100 nF 33 pF 33 pF D1 Figure 23 Reference Circuit Design for ECM Microphone Interface MIC3_P MEMS MIC R2 R1 C2 Module C1 MIC_BIAS3 1 2 3 4 F1 OUT GND GND VDD MIC3_M D1 C3 D2 33 pF 100 nF 0R 0R 33 pF Figure...

Page 66: ... 33 pF 33 pF C2 C3 C1 R1 Module D1 D2 0R 0R Figure 25 Reference Circuit Design for Earpiece Interface 3 22 3 Reference Circuit Design for Headset Interface 20K ESD MIC2_P HPH_L HS_DET HPH_R HPH_GND 33 pF Module 6 3 4 5 2 1 33 pF 33 pF C3 C4 C5 F3 F2 F1 D1 D2 D3 D4 F4 R2 R3 0R Figure 26 Reference Circuit Design for Headset Interface ...

Page 67: ...could be heard during voice calls Please note that the resonant frequency point of a capacitor largely depends on its material and manufacturing technique Therefore you should consult the capacitor vendors to choose the most suitable capacitor to filter out the high frequency noises The severity of RF interference in the voice channel during GSM transmitting largely depends on the application desi...

Page 68: ...ormal start up or running occur For firmware upgrade and debugging in the future reserve the following reference design Table 27 Pin Definition of USB_BOOT Interface LDO15A_1V8 S1 Module USB_BOOT R1 10K Figure 28 Reference Circuit Design for Emergency Download Interface Pin Name Pin No I O Description Comment USB_BOOT 46 DI Force the module into emergency download mode Force the module to enter em...

Page 69: ...z dual band WLAN based on IEEE 802 11a b g n ac standard protocols The maximum data rate is up to 150 Mbps in 2 4 GHz bands and 433 Mbps in 5 GHz bands The features are as below Supports Wake on WLAN WoWLAN Supports ad hoc mode Supports WAPI SMS4 hardware encryption Supports AP and STA mode Supports Wi Fi Direct Supports MCS 0 7 for HT20 and HT40 Supports MCS 0 8 for VHT20 Supports MCS 0 9 for VHT...

Page 70: ... 13 dBm 3 dB 802 11n HT20 MCS0 15 5 dBm 3 dB 802 11n HT20 MCS7 13 dBm 3 dB 802 11n HT40 MCS0 15 5 dBm 3 dB 802 11n HT40 MCS7 13 dBm 3 dB 802 11ac VHT20 MCS0 15 5 dBm 3 dB 802 11ac VHT20 MCS8 12 5 dBm 3 dB 802 11ac VHT40 MCS0 15 dBm 3 dB 802 11ac VHT40 MCS9 12 dBm 3 dB 802 11ac VHT80 MCS0 14 5 dBm 3 dB 802 11ac VHT80 MCS9 11 dBm 3 dB Frequency Bands Standard Rate Sensitivity 2 4 GHz 802 11b 1 Mbps ...

Page 71: ... GFSK 8 DPSK π 4 DQPSK modulation modes Maximally supports up to 7 wireless connections Maximally supports up to 3 5 piconets at the same time Support one SCO or eSCO connection 802 11n HT20 MCS7 71 dBm 802 11n HT40 MCS0 87 dBm 802 11n HT40 MCS7 70 dBm 5 GHz 802 11a 6 Mbps 90 dBm 802 11a 54 Mbps 74 dBm 802 11n HT20 MCS0 90 dBm 802 11n HT20 MCS7 70 dBm 802 11n HT40 MCS0 87 dBm 802 11n HT40 MCS7 68 ...

Page 72: ...cification RF PHY TS 4 0 0 December 15 2009 4 2 1 Bluetooth Performance The following table lists the Bluetooth transmitting and receiving performance of the module Table 31 Bluetooth Transmitting and Receiving Performance Version Data Rate Maximum Application Throughput 1 2 1 Mbit s 80 kbit s 2 0 EDR 3 Mbit s 80 kbit s 3 0 HS 24 Mbit s Reference 3 0 HS 4 0 24 Mbit s Reference 4 0 LE 5 0 24 Mbit s...

Page 73: ...rt GNSS and NavIC is supported by SC200E NA only Parameter Description Typ Unit Sensitivity Acquisition 147 dBm Reacquisition 159 dBm Tracking 159 dBm TTFF Cold start 31 2 s Warm start 24 7 s Hot start 1 32 s Accuracy CEP 50 1 95 m 1 Tracking sensitivity the minimum GNSS signal power at which the module can maintain lock keep positioning for at least 3 minutes continuously 2 Reacquisition sensitiv...

Page 74: ...al lines and RF components far away from high speed circuits switch mode power supplies power inductors the clock circuit of single chip microcomputers etc For applications with harsh electromagnetic environment or high ESD protection requirements it is recommended to add ESD protective diodes for the antenna interface The junction capacitance of the diodes should be less than 0 5 pF Otherwise it ...

Page 75: ...enna Interfaces Table 33 Pin Definition of Main Rx diversity Antenna Interfaces 6 1 1 Operating Frequency The operating frequencies of the modules are listed in the following tables Table 34 SC200E CE Operating Frequency Pin Name Pin No I O Description Comment ANT_MAIN 87 AIO Main antenna interface 50 Ω impedance ANT_DRX 131 AI Diversity antenna interface 3GPP Bands Receive Transmit Unit EGSM900 9...

Page 76: ...00 2400 MHz LTE TDD B41 2535 2675 2535 2675 MHz 3GPP Bands Receive Transmit Unit GSM850 869 894 824 849 MHz EGSM900 925 960 880 915 MHz DCS1800 1805 1880 1710 1785 MHz PCS1900 1930 1990 1850 1910 MHz WCDMA B1 2110 2170 1920 1980 MHz WCDMA B2 1930 1990 1850 1910 MHz WCDMA B4 2110 2155 1710 1755 MHz WCDMA B5 869 894 824 849 MHz WCDMA B8 925 960 880 915 MHz LTE FDD B1 2110 2170 1920 1980 MHz LTE FDD ...

Page 77: ...E TDD B41 2496 2690 2496 2690 MHz 3GPP Bands Receive Transmit Unit LTE FDD B2 1930 1990 1850 1910 MHz LTE FDD B4 2110 2155 1710 1755 MHz LTE FDD B5 869 894 824 849 MHz LTE FDD B7 2620 2690 2500 2570 MHz LTE FDD B12 729 746 699 716 MHz LTE FDD B13 746 756 777 787 MHz LTE FDD B14 758 768 788 798 MHz LTE FDD B17 734 746 704 716 MHz LTE FDD B25 1930 1995 1850 1915 MHz LTE FDD B26 859 894 814 849 MHz L...

Page 78: ...e capacitors are not mounted by default and the resistors are 0 Ω ANT_MAIN R1 0 Ω C1 Module NM C2 NM Main Antenna ANT_DIV R2 0 Ω C3 NM C4 NM Diversity Antenna Figure 29 Reference Circuit Design for Main and Rx diversity Antenna Interfaces 6 2 Wi Fi Bluetooth Antenna Interface The following tables show the pin definition and frequency specification of the Wi Fi Bluetooth antenna interface Table 37 ...

Page 79: ...NM C2 NM Wi Fi Bluetooth antenna Figure 30 Reference Circuit Design for Wi Fi Bluetooth Antenna 6 3 GNSS Antenna Interface The following tables show the pin definition and frequency specification of GNSS antenna interface Table 39 Pin Definition of GNSS Antenna Interface Type Frequency Unit Wi Fi 2 4 GHz 2402 2482 MHz Wi Fi 5 GHz 5180 5825 MHz Bluetooth 5 0 2402 2480 MHz Pin Name Pin No I O Descri...

Page 80: ...le ANT_GNSS NM C1 C2 C3 NM R1 0 Ω Figure 31 Reference Circuit Design for Passive GNSS Antenna It is not recommended to add an external LNA when using a passive GNSS antenna Type Frequency Unit GPS L1 1575 42 1 023 MHz GPS L5 1176 45 10 23 MHz GLONASS L1 1597 5 1605 8 MHz BDS B1I 1561 098 2 046 MHz Galileo E1 1575 42 2 046 MHz Galileo E5a 1176 45 10 23 MHz QZSS L1 1575 42 1 023 MHz QZSS L5 1176 45 ...

Page 81: ...ed to use a passive antenna If active antennas are required it is strongly recommended to reserve a π type attenuation and ensure that the total gain of the external GNSS RF path of the module is not greater than 0 dB At the same time this may compromise the GNSS performance depending on the performance of the active antenna 6 4 RF Routing Guidelines For user s PCB the characteristic impedance of ...

Page 82: ...Figure 33 Microstrip Design on a 2 layer PCB Figure 34 Coplanar Waveguide Design on a 2 layer PCB Figure 35 Coplanar Waveguide Design on a 4 layer PCB Layer 3 as Reference Ground Figure 36 Coplanar Waveguide Design on a 4 layer PCB Layer 4 as Reference Ground ...

Page 83: ...ould be complete Meanwhile adding some ground vias around RF traces and the reference ground could help to improve RF performance The distance between the ground vias and RF traces should be no less than two times the width of RF signal traces 2 W Keep RF traces away from interference sources and avoid intersection and paralleling between traces on adjacent layers For more details about RF layout ...

Page 84: ...ded to use the U FL R SMT receptacle provided by Hirose Figure 37 Dimensions of the U FL R SMT Receptacle Unit mm Polarization Type Vertical Cable Insertion Loss 1 dB GNSS Frequency range L1 1559 1609 MHz Frequency range L5 1166 1187 MHz SC200E NA only Polarization RHCP or linear VSWR 2 Typ Passive antenna gain 0 dBi Active antenna noise figure 1 5 dB Typ Active antenna gain 2 dBi Active antenna e...

Page 85: ...l plugs listed in the following figure can be used to match U FL R SMT Figure 38 Mechanicals of U FL LP Plugs The following figure describes the space factor of mated connectors Figure 39 Space Factor of Mated Connectors Unit mm For more details visit http www hirose com ...

Page 86: ...7 2 Power Supply Ratings Table 43 Power Supply Ratings Parameter Min Max Unit VBAT 0 5 6 V USB_VBUS 0 5 16 V Peak Current of VBAT 3 A Voltage on Digital Pins 0 3 2 16 V Parameter Description Conditions Min Typ Max Unit VBAT VBAT The actual input voltages must stay between the minimum and maximum values 3 5 3 8 4 4 V Voltage drop during transmitting burst Maximum power control level at EGSM900 400 ...

Page 87: ...ax Unit VIH Input high voltage 1 17 2 1 V VIL Input low voltage 0 3 0 63 V VOH Output high voltage 1 35 1 8 V VOL Output low voltage 0 0 45 V Parameter Description Min Max Unit USIM_VDD Power supply 1 75 1 85 V VIH Input high voltage 1 26 2 1 V VIL Input low voltage 0 3 0 36 V VOH Output high voltage 1 44 1 8 V VOL Output low voltage 0 0 4 V Parameter Description Min Max Unit USIM_VDD Power supply...

Page 88: ... module meets 3GPP specifications VOH Output high voltage 2 36 2 95 V VOL Output low voltage 0 0 4 V Parameter Description Min Max Unit VIH Input high voltage 1 27 2 V VIL Input low voltage 0 3 0 58 V VOH Output high voltage 1 4 V VOL Output low voltage 0 45 V Parameter Description Min Max Unit VIH Input high voltage 1 84 3 25 V VIL Input low voltage 0 3 0 74 V VOH Output high voltage 2 21 2 95 V ...

Page 89: ... USB disconnected DRX 7 4 21 mA Sleep state USB disconnected DRX 8 4 11 mA Sleep state USB disconnected DRX 9 3 87 mA CDMA supply current BC0 CH283 Slot Cycle Index 1 4 94 mA BC0 CH283 Slot Cycle Index 7 3 71 mA LTE FDD supply current Sleep state USB disconnected DRX 5 6 27 mA Sleep state USB disconnected DRX 6 5 mA Sleep state USB disconnected DRX 7 4 28 mA Sleep state USB disconnected DRX 8 4 17...

Page 90: ... mA EGSM900 4UL 1DL PCL 5 613 mA DCS1800 1UL 4DL PCL 0 190 mA DCS1800 2UL 3DL PCL 0 297 mA DCS1800 3UL 2DL PCL 0 356 mA DCS1800 4UL 1DL PCL 0 439 mA EDGE data transmission EGSM900 1UL 4DL PCL 8 202 mA EGSM900 2UL 3DL PCL 8 326 mA EGSM900 3UL 2DL PCL 8 436 mA EGSM900 4UL 1DL PCL 8 556 mA DCS1800 1UL 4DL PCL 2 178 mA DCS1800 2UL 3DL PCL 2 278 mA DCS1800 3UL 2DL PCL 2 374 mA DCS1800 4UL 1DL PCL 2 476...

Page 91: ... TDD B41 max power 433 mA Description Conditions Typ Unit OFF state Power off 39 μA GSM GPRS supply current Sleep state USB disconnected DRX 2 4 99 mA Sleep state USB disconnected DRX 5 4 24 mA Sleep state USB disconnected DRX 9 4 01 mA WCDMA supply current Sleep state USB disconnected DRX 6 4 57 mA Sleep state USB disconnected DRX 7 4 17 mA Sleep state USB disconnected DRX 8 3 97 mA Sleep state U...

Page 92: ...0 PCL 19 83 mA EGSM900 PCL 5 291 mA EGSM900 PCL 12 138 mA EGSM900 PCL 19 83 mA DCS1800 PCL 0 181 mA DCS1800 PCL 7 133 mA DCS1800 PCL 15 81 mA PCS1900 PCL 0 190 mA PCS1900 PCL 7 135 mA PCS1900 PCL 15 81 mA WCDMA voice call B1 max power 590 mA B2 max power 590 mA B4 max power 630 mA B5 max power 550 mA B8 max power 630 mA GPRS data transmission GSM850 1UL 4DL PCL 5 267 mA GSM850 2UL 3DL PCL 5 417 mA...

Page 93: ... 435 mA EDGE data transmission GSM850 1UL 4DL PCL 8 194 mA GSM850 2UL 3DL PCL 8 318 mA GSM850 3UL 2DL PCL 8 430 mA GSM850 4UL 1DL PCL 8 550 mA EGSM900 1UL 4DL PCL 8 200 mA EGSM900 2UL 3DL PCL 8 325 mA EGSM900 3UL 2DL PCL 8 438 mA EGSM900 4UL 1DL PCL 8 554 mA DCS1800 1UL 4DL PCL 2 173 mA DCS1800 2UL 3DL PCL 2 275 mA DCS1800 3UL 2DL PCL 2 376 mA DCS1800 4UL 1DL PCL 2 491 mA PCS1900 1UL 4DL PCL 2 171...

Page 94: ...SUPA max power 600 mA LTE data transmission LTE FDD B1 max power 645 mA LTE FDD B2 max power 600 mA LTE FDD B3 max power 630 mA LTE FDD B4 max power 670 mA LTE FDD B5 max power 580 mA LTE FDD B7 max power 650 mA LTE FDD B8 max power 585 mA LTE FDD B20 max power 605 mA LTE FDD B28 max power 570 mA LTE TDD B38 max power 370 mA LTE TDD B40 max power 370 mA LTE TDD B41 max power 400 mA Description Con...

Page 95: ...Sleep state USB disconnected DRX 9 TBD mA LTE data transmission LTE FDD B2 max power TBD mA LTE FDD B4 max power TBD mA LTE FDD B5 max power TBD mA LTE FDD B7 max power TBD mA LTE FDD B12 max power TBD mA LTE FDD B13 max power TBD mA LTE FDD B14 max power TBD mA LTE FDD B17 max power TBD mA LTE FDD B25 max power TBD mA LTE FDD B26 max power TBD mA LTE FDD B66 max power TBD mA LTE FDD B71 max power...

Page 96: ... 2 dB 39 dBm LTE TDD B39 23 dBm 2 dB 39 dBm LTE TDD B40 23 dBm 2 dB 39 dBm LTE TDD B41 23 dBm 2 dB 39 dBm Frequency Bands Max RF Output Power Min RF Output Power GSM850 33 dBm 2 dB 5 dBm 5 dB EGSM900 33 dBm 2 dB 5 dBm 5 dB DCS1800 30 dBm 2 dB 0 dBm 5 dB PCS1900 30 dBm 2 dB 0 dBm 5 dB WCDMA B1 24 dBm 1 3 dB 49 dBm WCDMA B2 24 dBm 1 3 dB 49 dBm WCDMA B4 24 dBm 1 3 dB 49 dBm WCDMA B5 24 dBm 1 3 dB 49...

Page 97: ...B 39 dBm LTE FDD B28 23 dBm 2 dB 39 dBm LTE TDD B38 23 dBm 2 dB 39 dBm LTE TDD B40 23 dBm 2 dB 39 dBm LTE TDD B41 23 dBm 2 dB 39 dBm Frequency Bands Max RF Output Power Min RF Output Power LTE FDD B2 23 dBm 2 dB 39 dBm LTE FDD B4 23 dBm 2 dB 39 dBm LTE FDD B5 23 dBm 2 dB 39 dBm LTE FDD B7 23 dBm 2 dB 39 dBm LTE FDD B12 23 dBm 2 dB 39 dBm LTE FDD B13 23 dBm 2 dB 39 dBm LTE FDD B14 23 dBm 2 dB 39 dB...

Page 98: ...A B1 110 5 112 TBD 106 7 WCDMA B8 111 112 TBD 103 7 EV DO CDMA BC0 108 5 104 LTE FDD B1 10 MHz 98 100 102 96 3 LTE FDD B3 10 MHz 98 5 98 5 101 5 93 3 LTE FDD B5 10 MHz 99 5 99 5 102 5 94 3 LTE FDD B8 10 MHz 99 100 102 5 93 3 LTE TDD B34 10 MHz 98 99 101 5 96 3 LTE TDD B38 10 MHz 97 98 99 6 96 3 LTE TDD B39 10 MHz 98 99 101 5 96 3 LTE TDD B40 10 MHz 97 5 98 5 101 96 3 LTE TDD B41 10 MHz 96 98 99 5 ...

Page 99: ...97 99 101 96 3 LTE FDD B5 10 MHz 99 99 2 102 94 3 LTE FDD B7 10 MHz 97 97 4 100 94 3 LTE FDD B8 10 MHz 99 99 5 102 93 3 LTE FDD B20 10 MHz 99 100 102 5 93 3 LTE FDD B28 10 MHz 99 99 5 102 94 8 LTE TDD B38 10 MHz 97 97 100 96 3 LTE TDD B40 10 MHz 97 5 98 5 100 5 96 3 LTE TDD B41 10 MHz 96 97 99 5 94 3 Frequency Bands Receiving Sensitivity dBm Typ 3GPP SIMO Primary Diversity SIMO LTE FDD B2 10 MHz T...

Page 100: ...terfaces and points in the product design The following table shows the electrostatic discharge characteristics of the module Table 59 Electrostatic Discharge Characteristics Temperature 25 ºC Humidity 45 LTE FDD B14 10 MHz TBD TBD TBD 93 3 LTE FDD B17 10 MHz TBD TBD TBD 93 3 LTE FDD B25 10 MHz TBD TBD TBD 92 8 LTE FDD B26 10 MHz TBD TBD TBD 93 8 LTE FDD B66 10 MHz TBD TBD TBD 95 8 LTE FDD B71 10 ...

Page 101: ...chanical Information This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm and the dimensional tolerances are 0 2 mm unless otherwise specified 8 1 Mechanical Dimensions Figure 40 Module Top and Side Dimensions ...

Page 102: ...Smart Module Series SC200E_Series_Hardware_Design 101 115 Figure 41 Module Bottom Dimensions Bottom View The package warpage level of the module conforms to JEITA ED 7306 standard NOTE ...

Page 103: ...es_Hardware_Design 102 115 8 2 Recommended Footprint Figure 42 Recommended Footprint Top View Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience NOTE ...

Page 104: ...103 115 8 3 Top and Bottom Views Figure 43 Top and Bottom Views of the Module Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label please refer to the module received from Quectel NOTE ...

Page 105: ... dry cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storage Condition Violation of the third requirement mentioned above Vacuum sealed packaging is broken or the packaging has been removed for over 24 hours Before module repairing 5 If needed the pre baking should follow...

Page 106: ...ste fill the stencil openings and then penetrate to the PCB Apply proper force on the squeegee to produce a clean stencil surface on a single pass To guarantee module soldering quality the thickness of stencil for the module is recommended to be 0 18 0 20 mm For more details see document 4 The peak reflow temperature should be 235 246 ºC with 246 ºC as the absolute maximum reflow temperature To av...

Page 107: ... cleaning since it can damage crystals inside the module 3 Due to the complexity of the SMT process please contact Quectel Technical Supports in advance for any situation that you are not sure about or any process e g selective soldering ultrasonic soldering that is not mentioned in document 4 Factor Recommendation Soak Zone Max slope 1 3 C s Soak time between A and B 150 C and 200 C 70 120 s Refl...

Page 108: ... Packaging Specification Dimension details are as follow Figure 45 Carrier Tape Dimension Drawing Table 61 Recommended Thermal Profile Parameters 9 3 1 Plastic Reel Figure 46 Plastic Reel Dimension Drawing W P T A0 B0 K0 K1 F E 72 56 0 4 41 2 41 2 4 4 6 34 2 1 75 ...

Page 109: ...e and use the cover tape to cover them then wind the heat sealed carrier tape to the plastic reel and use the protective tape for protection One plastic reel can load 200 modules Place the packaged plastic reel humidity indicator card and desiccant bag into a vacuum bag then vacuumize it Place the vacuum packed plastic reel into a pizza box Put 4 pizza boxes into 1 carton and seal it One carton ca...

Page 110: ...on_Note 4 Quectel_Module_Secondary_SMT_Application_Note Abbreviation Description 3GPP 3rd Generation Partnership Project ADC Analog to Digital Converter ADSP Audio Digital Signal Processor ALS Ambient Light Sensor AMR NB Adaptive Multi Rate Narrow Band Speech Codec AMR WB Adaptive Multi Rate Wideband AP Access Point Application Processor ARM Advanced RISC Machine BDS BeiDou Navigation Satellite Sy...

Page 111: ...munications Equipment Data Circuit terminating Equipment DCS Digital Cellular System DL Downlink DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Reference Phase Shift Keying DRX Discontinuous Reception DSI Display Serial Interface DSP Digital Signal Processor DTE Data Terminal Equipment ECM Electret Condenser Microphone EDGE Enhanced Data Rate for GSM Evolution EDR Enhanced Data...

Page 112: ...FR Full Rate Galileo Galileo Satellite Navigation System EU GFSK Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System Russia GMSK Gaussian Minimum Shift Keying GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GPS Global Positioning System GPU Graphics Processing Unit GRFC Generic RF control GSM Global Syste...

Page 113: ...r the year 2000 I O Input Output IImax Maximum Input Load Current IOmax Maximum Output Load Current ISP Image Signal Processor Internet Service Provider LCC Leadless Chip Carrier LCD Liquid Crystal Display LCM LCD Module LDO Low Dropout Regulator LE Low Energy LED Light Emitting Diode LGA Land Grid Array LNA Low Noise Amplifier LPDDR Low Power Double Data Rate LTE Long Term Evolution M2M Machine t...

Page 114: ...evels MT Mobile Terminating Terminated NavIC Indian Regional Navigation Satellite System N W Net Weight NFC Near Field Communication NTC Negative Temperature Coefficient OTA Over the Air Upgrade OTG On The Go OTP One Time Programable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PCS Personal Communication Service PDA Personal Digital Assistant PDU Protoc...

Page 115: ...of Hazardous Substances RTC Real Time Clock RTS Request to Send SBAS Satellite Based Augmentation System SCO Synchronous Connection Oriented SD Secure Digital SIMO Single Input Multiple Output SMD Surface Mounting Device SMS Short Message Service SMT Surface Mount Technology STA Station TDD Time Division Duplex TP Touch Panel TTFF Time to First Fix TVS Transient Voltage Suppressor UART Universal A...

Page 116: ...imum Input Voltage VImin Absolute Minimum Input Voltage VIHmin Minimum High level Input Voltage VILmax Maximum Low level Input Voltage VOmax Maximum Output Voltage VOHmin Minimum High level Output Voltage VOLmax Maximum Low level Output Voltage Vrms Root Mean Square Voltage VSWR Voltage Standing Wave Ratio WAPI WLAN Authentication and Privacy Infrastructure WCDMA Wideband Code Division Multiple Ac...

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