Quectel M66, Hardware Design

Page: 5 / 81

GSM/GPRS Module Series
M66 Hardware Design
M66_Hardware_Design Confidential / Released 4 / 80
3.7.3. Auxiliary UART Port ....................................................................................................... 38
3.7.4. UART Application ........................................................................................................... 38
3.8. Audio Interfaces ....................................................................................................................... 40
3.8.1. Decrease TDD Noise and other Noise .......................................................................... 41
3.8.2. Microphone Interfaces Design ....................................................................................... 41
3.8.3. Receiver and Speaker Interface Design ........................................................................ 42
3.8.4. Earphone Interface Design ............................................................................................ 44
3.8.5. Audio Characteristics ..................................................................................................... 44
3.9. PCM Interface .......................................................................................................................... 45
3.9.1. Configuration .................................................................................................................. 45
3.9.2. Timing ............................................................................................................................. 46
3.9.3. Reference Design .......................................................................................................... 48
3.9.4. AT Command ................................................................................................................. 48
3.10. SIM Card Interface................................................................................................................... 49
3.11. ADC ......................................................................................................................................... 51
3.12. Behaviors of The RI ................................................................................................................. 51
3.13. Network Status Indication ........................................................................................................ 53
3.14. RF Transmitting Signal Indication ............................................................................................ 54
4 Antenna Interface ............................................................................................................................... 56
4.1. GSM Antenna Interface ........................................................................................................... 56
4.1.1. Reference Design .......................................................................................................... 56
4.1.2. RF Output Power ........................................................................................................... 57
4.1.3. RF Receiving Sensitivity ................................................................................................ 58
4.1.4. Operating Frequencies................................................................................................... 58
4.1.5. RF Cable Soldering ........................................................................................................ 59
4.2. Bluetooth Antenna Interface .................................................................................................... 59
5 Electrical, Reliability and Radio Characteristics ............................................................................ 61
5.1. Absolute Maximum Ratings ..................................................................................................... 61
5.2. Operating Temperature ............................................................................................................ 61
5.3. Power Supply Ratings ............................................................................................................. 62
5.4. Current Consumption .............................................................................................................. 63
5.5. Electro-static Discharge ........................................................................................................... 65
6 Mechanical Dimensions .................................................................................................................... 66
6.1. Mechanical Dimensions of Module .......................................................................................... 66
6.2. Recommended Footprint ......................................................................................................... 68
6.3. Top View of the Module ........................................................................................................... 69
6.4. Bottom View of the Module ...................................................................................................... 69
7 Storage and Manufacturing .............................................................................................................. 70
7.1. Storage..................................................................................................................................... 70
7.2. Soldering .................................................................................................................................. 71
7.3. Packaging ................................................................................................................................ 71
7.3.1. Tape and Reel Packaging .............................................................................................. 72
Quectel
Confidential