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M10 Hardware Design
M10_HD_V3.0
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3. Application interface
The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular
application platform. Sub-interfaces included in these pads are described in detail in following
chapters:
Power supply
(refer to Chapter 3.3)
Serial interfaces
(refer to Chapter 3.8)
Two analog audio interfaces
(refer to Chapter 3.9)
SIM interface
(refer to Chapter 3.10)
SD card interface
(refer to Chapter 3.18)
Electrical and mechanical characteristics of the SMT pad are specified in
Chapter 5&Chapter6
.
3.1. Pin of module
3.1.1. Pin assignment
The following figure shows pin name and assignment of M10.
Figure 2: Top view of module pin assignment
Summary of Contents for M10
Page 1: ...M10 Quectel Cellular Engine Hardware Design M10_HD_V3 0...
Page 9: ...M10 Hardware Design M10_HD_V3 0 8 7 Deleted the content of charging function...
Page 68: ...M10 Hardware Design M10_HD_V3 0 67 Figure 47 Recommendation of RF pad welding...
Page 76: ...M10 Hardware Design M10_HD_V3 0 75 6 2 Footprint of recommendation single pad...