LTE-A Module Series
EP06 Series Hardware Design
EP06_Series_Hardware_Design 49 / 56
6.8. Thermal Consideration
In order to achieve better performance of the module, it is strongly recommended to comply with the
following principles for thermal consideration:
On customers’ PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply.
Do not place components on the PCB area where the module is mounted, in order to facilitate adding
of heatsink.
The reference ground of the area where the module is mounted should be complete, and add ground
vias as many as possible for better heat dissipation.
Add a heatsink on the top of the module and the heatsink should be designed with as many fins as
possible to increase heat dissipation area. Meanwhile, a thermal pad with high thermal conductivity
should be used between the heatsink and module.
Add a thermal pad with appropriate thickness at the bottom of the module to conduct the heat to
PCB.
The following shows the referenced heatsink and thermal pad designs.
Heatsink
EP06 Module
Application Board
Thermal Pad
Shielding Cover
MiniPCIe Connector
Application Board
Heatsink
Heatsink
EP06 Module
PCBA
Figure 16: Referenced Heatsink Design
Open Sky @ Passive Antenna
30.0
mA
