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Wi-Fi&Bluetooth Module Series

AF20_Hardware_Design

4 / 49

metal powders.

Summary of Contents for AF20

Page 1: ...AF20 Hardware Design Wi Fi Bluetooth Module Series Version 1 1 Date 2022 10 18 Status Released...

Page 2: ...we employ commercially reasonable efforts to provide the best possible experience you hereby acknowledge and agree that this document and related services hereunder are provided to you on an as availa...

Page 3: ...To implement module functionality certain device data are uploaded to Quectel s or third party s servers including carriers chipset suppliers or customer designated servers Quectel strictly abiding by...

Page 4: ...y cause interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or...

Page 5: ...Wi Fi Bluetooth Module Series AF20_Hardware_Design 4 49 metal powders...

Page 6: ...t official release 1 1 2022 10 18 Arrow HUANG 1 Updated the pin 42 from RESERVED to HOST_WAKE_BT Updated the pin 46 from RESERVED to BT_WAKE_HOST 2 Added DFS function description Chapter 2 3 Updated p...

Page 7: ...WLAN_EN 21 3 5 2 SDIO Interface 22 3 6 Bluetooth Application Interface 23 3 6 1 BT_EN 24 3 6 2 PCM Interface 24 3 6 3 Bluetooth UART 25 3 7 Coexistence UART 26 3 8 32KHZ_IN 26 3 9 RF Antenna Interface...

Page 8: ...5 2 Recommended Footprint 40 5 3 Top and Bottom Views 41 6 Storage Manufacturing and Packaging 42 6 1 Storage Conditions 42 6 2 Manufacturing and Soldering 43 6 3 Packaging Specification 45 6 3 1 Carr...

Page 9: ...7 Table 14 Operating Frequency of the Module 27 Table 15 Antenna Requirements 30 Table 16 Absolute Maximum Ratings 33 Table 17 Recommended Operating Conditions 33 Table 18 Digital I O Characteristics...

Page 10: ...Antenna Interface Vehicle Applications 28 Figure 13 Microstrip Design on a 2 layer PCB 29 Figure 14 Coplanar Waveguide Design on a 2 layer PCB 29 Figure 15 Coplanar Waveguide Design on a 4 layer PCB...

Page 11: ...cifications electrical and mechanical details as well as other related information of the module The document coupled with application notes and user guides makes it easy to design and set up mobile a...

Page 12: ...AG35 so as to provide AG35 with Wi Fi and Bluetooth functions Connection between AF20 and AG35 via the coexistence interface helps reduce the interference between LTE signal and Wi Fi Bluetooth signa...

Page 13: ...smitting Power 2 4 GHz 802 11b 11Mbps 16 dBm 2 5 dB 802 11g 54Mbps 14 dBm 2 5 dB 802 11n HT20 MCS7 13 dBm 2 5 dB 802 11n HT40 MCS7 13 dBm 2 5 dB 5 GHz 802 11a 54Mbps 11 dBm 2 5 dB 802 11n HT20 MCS7 9...

Page 14: ...m The following figure shows a block diagram of AF20 module Figure 1 Functional Diagram 2 3 EVB Kit To help you develop applications with the module Quectel supplies an evaluation board UMTS LTE EVB w...

Page 15: ...0 module is equipped with 52 LGA pins that can be connected to the cellular application platform The subsequent chapters will provide a detailed introduction on the following module interfaces Power s...

Page 16: ...Wi Fi Bluetooth Module Series AF20_Hardware_Design 15 49 3 2 Pin Assignment Figure 2 Pin Assignment Top View...

Page 17: ...e 4 Pin Description Power Supply Pin Name Pin No I O Description DC Characteristics Comment VDD_3V3 21 PI Main power supply for the module Vmax 3 46 V Vmin 3 14 V Vnom 3 3 V It must be provided with s...

Page 18: ...led up to 1 8 V internally SDIO_D1 24 DIO SDIO data bit 1 VOLmax 0 18 V VOHmin 1 62 V VILmin 0 3 V VILmax 0 54 V VIHmin 1 26 V VIHmax 2 0 V 1 8 V power domain SDIO_D0 25 DIO SDIO data bit 0 VOLmax 0 1...

Page 19: ...VILmin 0 3 V VILmax 0 54 V VIHmin 1 26 V VIHmax 2 0 V BT_UART_ TXD 17 DO Bluetooth UART transmit VOLmax 0 18 V VOHmin 1 62 V BT_UART_ RXD 18 DI Bluetooth UART receive VILmin 0 3 V VILmax 0 54 V VIHmin...

Page 20: ...RF_ANT 30 AIO Wi Fi and Bluetooth antenna 50 impedance 32KHZ_IN Pin Name Pin No I O Description DC Characteristics Comment 32KHZ_IN 19 DI Used as a timer in low power modes External 32 768 kHz clock...

Page 21: ...exceeding 0 6 A The following figure shows a reference design for VDD_3V3 which is controlled by PM_ENABLE And PM_ENABLE should be connected to the pin 5 PM_ENABLE of AG35 module For more details see...

Page 22: ...function of AF20 Wi Fi function will be enabled when WLAN_EN is at high level Table 6 Pin Definition of WLAN_EN WLAN_EN is a sensitive signal and thus should be ground shielded and routed as close as...

Page 23: ...Table 7 Pin Definition of SDIO Interface Pin Name Pin No I O Description Comment SDIO_D3 22 DIO SDIO data bit 3 1 8 V power domain SDIO_D2 23 DIO SDIO data bit 2 1 8 V power domain It is pulled up to...

Page 24: ...s are surrounded by ground vias and not crossed with each other Keep SDIO traces as short as possible with equal length It is recommended to keep the trace length difference between SDIO_CLK and SDIO_...

Page 25: ...able 8 Pin Definition of BT_EN Pin Name Pin No I O Description Comment BT_EN 10 DI Bluetooth enable control 1 8 V power domain Active high 3 6 2 PCM Interface Table 9 Pin Definition of PCM Interface P...

Page 26: ...uetooth UART Interface Pin Name Pin No I O Description Comment BT_UART_RTS 7 DO Bluetooth UART request to send 1 8 V power domain BT_UART_CTS 8 DI Bluetooth UART clear to send BT_UART_TXD 17 DO Blueto...

Page 27: ...used on third party platforms LTE_UART_RXD 6 DI LTE Wi Fi Bluetooth coexistence signal AF20 module supports LTE Wi Fi coexistence and LTE Bluetooth coexistence The following figure shows the coexisten...

Page 28: ...O Description Comment RF_ANT 30 AIO Wi Fi Bluetooth antenna interface 50 impedance 3 9 2 Operating Frequency Table 14 Operating Frequency of the Module Feature Frequency Unit 2 4 GHz Wi Fi 2 412 2 472...

Page 29: ...ircuit Capacitors C1 C2 C3 C4 and inductors L1 L2 are not mounted by default and R1 is only mounted with 0 resistor Figure 12 Reference Design of RF Antenna Interface Vehicle Applications 3 9 4 RF Rou...

Page 30: ...igure 13 Microstrip Design on a 2 layer PCB Figure 14 Coplanar Waveguide Design on a 2 layer PCB Figure 15 Coplanar Waveguide Design on a 4 layer PCB Layer 3 as Reference Ground Figure 16 Coplanar Wav...

Page 31: ...rence ground of RF traces should be complete Meanwhile ground vias around RF traces and the reference ground can improve RF performance The clearance between ground vias and RF traces should be at lea...

Page 32: ...17 Dimensions of the Receptacle Unit mm U FL LP series mated plugs listed in the following figure can be used to match the U FL R SMT connector Figure 18 Specifications of Mated Plugs Unit mm The foll...

Page 33: ...Wi Fi Bluetooth Module Series AF20_Hardware_Design 32 49 Figure 19 Space Factor of the Mated Connectors Unit mm For more details visit http www hirose com...

Page 34: ...V VIO 0 3 1 89 V Voltage at digital pins 0 3 VIO 0 2 V Table 17 Recommended Operating Conditions Parameter Min Typ Max Unit VDD_3V3 3 14 3 3 3 46 V VIO 1 71 1 8 1 89 V 4 2 Digital I O Characteristics...

Page 35: ...TBD TBD mA 802 11b Tx 1 Mbps 17 3 dBm 366 4 5 9 mA Tx 11 Mbps 17 3 dBm 338 6 5 9 mA 802 11g Tx 6 Mbps 15 9 dBm 321 5 5 9 mA Tx 54 Mbps 15 3 dBm 234 8 5 9 mA 802 11n 2 4 GHz Tx HT20 MCS 0 15 7 dBm 315...

Page 36: ...15 dBm 802 11n HT20 MCS 7 10 5 13 dBm 802 11n HT40 MCS 0 12 5 15 dBm 802 11n HT40 MCS 7 10 5 13 dBm Table 21 Conducted RF Output Power at 5 GHz Frequency Min Typ Unit 802 11a 6 Mbps 9 5 12 dBm 802 11a...

Page 37: ...eiving Sensitivity Typ 802 11b 1 Mbps 95 0 dBm 802 11b 11 Mbps 88 0 dBm 802 11g 6 Mbps 90 0 dBm 802 11g 54 Mbps 73 5 dBm 802 11n HT20 MCS 0 89 5 dBm 802 11n HT20 MCS 7 70 5 dBm 802 11n HT40 MCS 0 87 5...

Page 38: ...nd it may damage the module Therefore applying proper ESD countermeasures and handling methods is imperative For example wear anti static gloves during the development production assembly and testing...

Page 39: ...This chapter describes the mechanical dimensions of the module All dimensions are measured in millimeter mm All dimensions are measured in millimeter mm and the dimensional tolerances are 0 2 mm unles...

Page 40: ...Wi Fi Bluetooth Module Series AF20_Hardware_Design 39 49 Figure 21 Bottom Dimensions Bottom View The package warpage level of the module conforms to JEITA ED 7306 standard NOTE...

Page 41: ...s AF20_Hardware_Design 40 49 5 2 Recommended Footprint Fig ure 22 Recommended Footprint Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and m...

Page 42: ...41 49 5 3 Top and Bottom Views Figure 23 Top and Bottom Views of the Module Images above are for illustration purpose only and may differ from the actual module For authentic appearance and label ple...

Page 43: ...dry cabinet 4 The module should be pre baked to avoid blistering cracks and inner layer separation in PCB under the following circumstances The module is not stored in Recommended Storage Condition V...

Page 44: ...king the paste fill the stencil openings and then penetrate to the PCB Apply proper force on the squeegee to produce a clean stencil surface on a single pass To guarantee module soldering quality the...

Page 45: ...information on the shielding can is still clearly identifiable and the QR code is still readable although white rust may be found 4 If a conformal coating is necessary for the module do not use any co...

Page 46: ...e for reference only The appearance and structure of the packaging materials are subject to the actual delivery The module adopts carrier tape packaging and details are as follow 6 3 1 Carrier Tape Di...

Page 47: ...rawing Table 27 Plastic Reel Dimension Table Unit mm 6 3 3 Packaging Process Place the module into the carrier tape and use the cover tape to cover it then wind the heat sealed carrier tape to the pla...

Page 48: ...e packaged plastic reel humidity indicator card and desiccant bag into a vacuum bag vacuumize it Place the vacuum packed plastic reel into the pizza box Put 4 packaged pizza boxes into 1 carton and se...

Page 49: ...Bluetooth CCK Complementary Code Keying CTS Clear To Send DFS Dynamic Frequency Selection ESD Electrostatic Discharge GND Ground HT High Throughput IEEE Institute of Electrical and Electronics Enginee...

Page 50: ...estriction of Hazardous Substances RTS Request To Send Rx Receive Direction SDIO Secure Digital Input and Output Card TBD To Be Determined Tx Transmitting Direction UART Universal Asynchronous Receive...

Page 51: ...Wi Fi Bluetooth Module Series AF20_Hardware_Design 50 49 VSWR Voltage Standing Wave Ratio WLAN Wireless Local Area Networks...

Page 52: ...his device may be operated in all member states of the EU Observ e national and local regulations where the device is used This device is restricted to indoor use only when operating in 5150to 5350Mhz...

Page 53: ...usly with any other antenna or transmitter 6 The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with...

Page 54: ...tructions on how end users can find and or access the module and the FCC ID The final host module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiator...

Page 55: ...Changes or modifications not expressly approved by the manufacturer could void the user s authority to operate the equipment...

Page 56: ...s a mobile device And the following conditions must be met 1 This Modular Approval is limited to OEM installation for mobile and fixed applications only The antenna installation and operating configur...

Page 57: ...be provided with labeling instructions of finished products Please refer to KDB784748 D01 v07 section 8 Page 6 7 last two paragraphs A certified modular has the option to use a permanently affixed lab...

Page 58: ...compliance could void the user s authority to operate the equipment In cases where the manual is provided only in a form other than paper such as on a computer disk or over the Internet the informatio...

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