IAC-IMX6-Kit Hardware Manual
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Website
:http://www.qiytech.com
©2012 Qiyangtech
Copyright
Test Program
Interface using demo test program and test program source code
Source Code
Bootloader, kernel, system source code
Manual
Mainboard User Manual, Device Manual
Mechanical Chart Back Plane’s Structure & Size
E
lect
ri
cal
S
pe
ci
ficat
ion
Size
Core Board:86mm*60mm
Back Plane:160mm*125mm
Layer
Core Board:8-layer high precision immersion gold process
Back Board: 4-layer high precision immersion gold process
Power
Consumption
≤
3W
Operation
Temperature
-20
℃
~ +70
℃
(Could be upgraded to industrial level temperature)
Operation
Humidity
5% ~ 95%, Non-Condensing
