IAC-A5D3x-Kit Hardware Manual
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Mechanical Chart Mainboard structure and size chart
Size
Core Board: 74mm*53mm;Back Plane:160mm*110mm
Layer
Core Bord:8-layer high precision immersion gold process; Back
Plane:4-layer high precision immersion gold process
Power
Consumption
Core Board<1W;Whole Board
≤
2W
Operation
Temperature
-20
℃
~ +70
℃
（
Can be customized to the industrial range -40
℃
~ +85
℃）
Electricity Character
Working
Humidity
5%-95%, Non-Condensing
2.4 Core Board Resource
IAC-A5D3X-CM core board has high precision of 8-layer PCB board with the
best electric performance and anti-interference performance; hardware resources:
integration of CPU, NorFlash, RAM, network chip, as many as 200pins. It fully
expands the
SAMA5D3X
hardware resources and the user can make combination of
different interface functions by reusing pin, also can clip hardware by yourself, and
make the most suitable back plane.
Front Side Back Side
