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AN-1501 

   

 

Application Note 

 

www.power.com/igbt-driver                  

Page 1 

 

Handling  Instructions  for  SCALE™-1 and SCALE™-2  Gate 

Drivers 

 

Scope 

This Application Note defines  the  requirements  for handling the  high-power  SCALE™-1 and SCALE™-2 

products (gate driver cores, plug-and-play gate drivers) from Power Integrations in terms of: 

 

Storage conditions 

 

Soldering instructions for gate driver core products  

 

Mechanical handling 

 

ESD handling 

 

Guideline for Return Material Analysis - RMA  

 
The information given here applies to all customers, distributors and suppliers receiving high-power products 

from Power Integrations. 

 

Content 

Scope .............................................................................................................................................. 1

 

Content ........................................................................................................................................... 1

 

Storage Conditions ......................................................................................................................... 2

 

Soldering Instructions for Driver Core Products............................................................................ 3

 

Reflow Soldering.................................................................................................................. 3

 

Wave Soldering ................................................................................................................... 3

 

Selective Soldering............................................................................................................... 3

 

Manual Soldering ................................................................................................................. 4

 

Mechanical Handling ...................................................................................................................... 4

 

Insertion of Gate Driver Cores into the Carrier PCB ................................................................. 4

 

ESD Handling .................................................................................................................................. 6

 

EPA (Electrostatic Protected Area) ......................................................................................... 6

 

Guideline for Return Material Analysis - RMA ................................................................................ 6

 

Legal Disclaimer ............................................................................................................................. 7

 

Manufacturer .................................................................................................................................. 7

 

Power Integrations Worldwide High Power Customer Support Locations .................................... 8

 

 

 

 

Summary of Contents for SCALE-1

Page 1: ...eline for Return Material Analysis RMA The information given here applies to all customers distributors and suppliers receiving high power products from Power Integrations Content Scope 1 Content 1 Storage Conditions 2 Soldering Instructions for Driver Core Products 3 Reflow Soldering 3 Wave Soldering 3 Selective Soldering 3 Manual Soldering 4 Mechanical Handling 4 Insertion of Gate Driver Cores i...

Page 2: ...ed desiccant Humidity Indicator Card HIC sealed moisture barrier bag ESD protection Nitrogen 25 C 10 C 85 48 Table 1 Environmental conditions and lifetime during storage and transportation Legend 1 Low pollution atmosphere and packaging 2 Valid for single packed drivers 3 Valid for single packed trays and stored in a nitrogen atmosphere 4 Number of desiccant units to be calculated according to JED...

Page 3: ...ragging rate 2 8mm s3 Point soldering time 3 5s4 1 depending on the length of the wave soldering machine 2 depending on the thermal mass and components on the board when it reaches the solder pot 3 depending on the solder joint size The solder nozzle should be selected depending on the surface area of the solder joint 4 depending on the size of the solder joint Parameter Leaded Lead Free Flux 25 w...

Page 4: ...reseeable it is necessary to mechanically stabilize the driver Insertion of Gate Driver Cores into the Carrier PCB It is recommended that no large steady state or temporary mechanical force be applied to the transformers or terminals of the gate core drivers Applying excessive mechanical force to the transformer bends the PCB and considerably stresses the transformer solder joints leading to poten...

Page 5: ...m by 51 56mm The maximum permissible bending due to forces applied to the PCB would be 0 29mm and 0 26mm respectively Fig 2 Dimensions of a standard Power Integrations gate driver core In case of Plug and Play drivers which are screw fitted to a power module it is important to adjust the height of the distance bolts properly This will increase the driver s vibration withstand capability and avoid ...

Page 6: ...o be kept to a minimum Guideline for Return Material Analysis RMA The following requirements are necessary to ensure proper RMA process handling Acquire RMA number from the Power Integrations Customer Service Department before return For each RMA case a Driver Failure Description Form DFDF must be completed In the customs documents a goods value of 1 USD must be specified Returned product must be ...

Page 7: ...the accuracy or completeness of the statements technical information and recommendations contained herein No responsibility is accepted for the accuracy or sufficiency of any of the statements technical information recommendations or opinions communicated and any liability for any direct indirect or consequential loss or damage suffered by any person arising therefrom is expressly disclaimed Manuf...

Page 8: ...uilding No 2 Keji South 8th Road Nanshan District Shenzhen China 518057 Phone 86 755 8672 8725 Fax 86 755 8672 8690 Hotline 86 400 0755 669 Email chinasales power com UK Cambridge Westbrook Centre Block 5 2nd Floor Milton Road Cambridge CB4 1YG Phone 44 0 1223 446483 Email eurosales power com India Bangalore 1 14th Main Road Vasanthanagar Bangalore 560052 India Phone 91 80 4113 8020 Fax 91 80 4113...

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