Page 2 of 5
1.
Board preparation
Apply flux to the SMD pads. Tin one pad of each SMD footprint with a SMALL amount of solder.
For the ICs, apply a tiny amount of solder to two opposite corner pins.
2.
1206 Size Resistors and ceramic capacitors
Install the 1206 resistors and 1206 capacitors on the TOP of the board by positioning on the
footprint and heating the cap and tinned pad until the part is attached. When all 1206 parts
have been attached. Solder the opposite pad of each part. Finally, reheat and add solder if
necessary to finalize the first pad of each part.
3.
ICs