PCI 9656RDK- LITE Hardware Reference Manual v1.4
8
© 2006 PLX Technology, Inc. All rights reserved.
2.9.2
Debug and Status LEDs
There are five green LEDs (D1-D5) at the top
edge of the RDK board – D5 is a power on
indicator, and four are user-defined LEDs. The
anode of each user-defined LED is
connected to
3.3V
CC
through a 150-ohm ¼ watt resistor. The
cathode of each LED is connected to a
prototyping pad for customer use. As long as an
active low signal can sink 16 – 20 mA of current,
it can drive the LEDs without changing the
resistor value.
2.9.3 Reset
Circuitry
The reset circuitry ships configured as a user-
defined reset circuit for general power-on reset
and manual reset by pressing the pushbutton
(S1).
The reset circuitry can be re-configured to
emulate the power management event request
(PMEREQ#) from the Processor/Local Bus side
to wake up the PCI system from the D3
cold
state.
When the pushbutton (S1) is pressed, the reset
circuitry asserts PMEREQ# to the PCI 9056. In
response, the PCI 9056 will assert the PCI bus
PME# signal to wake up the system from D3
cold
state. (Note: please view Erratum #11 which
describes PME# generation in D3
cold
. This
erratum will affect the above functionality and
should be taken into consideration in your
product design).
Table 2-5 details the how to configure the RDK
reset circuitry for user-defined reset and Power
Management Event request generation.
Table 2-5. Reset Circuit Configuration
R41 (installed)
User defined reset
circuit (default)
R40, R43 (not installed)
R40, R43 (installed)
Emulate
PMEREQ# input
R41 (not installed)
2.9.4
Flash ROM Socket
A 32-pin PLCC socket (FP31) is provided on the
RDK, which can be used to install a 3.3V,
512KBx8 Flash memory device. Its power and
ground are pre-wired and it has pads available
on the board for control signals and
data/address lines.
2.10 Prototyping Area
The RDK board contains a large prototyping
area with surface-mount footprints, BGA
footprints, and a through-hole grid.
2.10.1 Surface Mount Footprints
The RDK board has thirty (30) surface mount
footprints. See Table 2-6 for details.
These footprints will accommodate a wide
variety of devices, including industry leading
embedded microprocessors, DSPs, FPGAs,
FIFOs, memory, I/O devices, etc.
2.10.2 BGA
Footprints
This RDK has two (2) common pitch BGA
footprints. See Table 2-7 for details.
BGA1 is a full matrix of 25x25 @ 1.0mm pitch
holes with a plated hole size of 0.0165” diameter
+/-0.001”. BGA2 is a full matrix of 26x26 @
0.05” pitch holes with a plated hole size of
0.022” di/-0.001”.
Note.
These BGA footprints appear on the RDK
board, but are not included in the schematics.
PLX recommends using Ironwood Electronics
(www.ironwoodelectronics.com) BGA Land
Sockets and/or Minigrid Sockets to convert from
BGA to PGA, and prototype BGA chips on this
RDK.
