PhlatLight
®
DK-409N Series Development Kit Manual
960018 Rev A © 2008 Luminus Devices, Inc. All rights reserved.
Page 3
2.1
Heat Sink
The heat sink is a high performance, low cost and compact air cooled copper sub mount with copper fins.
Measuring 82 mm x 65 mm x 38mm, the heat sink occupies a very small volume. The typical thermal
resistance from heat sink to ambient with the fan in operation is 0.3 ºC/W, thereby enabling significant
power dissipation.
The bolt pattern on the front face of the sink allows for easy mounting of all CBM series modules.
2.2
Development Board
The driver circuit, designed around National Semiconductor’s LM3421 IC, is designed to provide up to 9A
of current to any CBM PhlatLight LED. The board is mounted close to the heat sink and LED to ensure
cable lengths are kept at a minimum (<3”). Longer cable lengths will cause increased current ringing
when pulsing the LEDs.
The driver board is fully capable of driving the LEDs in either CW or pulsed mode. The PWM frequency is
set to 25kHz. An external function generator is required for generating the pulse trains in the triggered
mode and external PWM mode.
The driver requires a 24VDC input from an external AC/DC source. The external trigger voltage range is of
5 – 10V and the external PWM voltage input range is between 0 – 10V. Care must be taken to not exceed
these voltages as it may cause permanent damage to the driver board.
2.3
Cable Assembly
Each development kit includes all of the cables necessary for proper setup. The primary cables included
are as follows:
•
Power supply to development board
•
Driver board to LED
For optimum performance, it is not recommended to increase the length of the driver to LED cable. A
longer cable will result in decreased performance when pulsing the LEDs.
2.4
Thermal Interface Material (TIMs) and Mounting Hardware
Also included in the kit are precut sheets of a high performance thermal interface material (eGraf
HiTherm 1205) and the required mounting hardware for the devices.
M2.5x6 screws are provided for attachment of CBM and CSM package types.
Figure 2: TIM cut for CBM and CSM package types.