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Philips TDA8566TH, Datasheet

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Philips TDA8566TH Datasheet Download Page 4

2001 Apr 24

4

Philips Semiconductors

Objective specification

2

×

40 W/2

Ω

 stereo BTL car radio power amplifier

with differential inputs and diagnostic outputs

TDA8566TH

PINNING

SYMBOL

PIN

DESCRIPTION

DIAG

1

short-circuit and temperature
pre-warning diagnostic output

IN2+

2

channel 2 input positive

IN2

−

3

channel 2 input negative

n.c.

4

not connected

n.c.

5

not connected

n.c.

6

not connected

n.c.

7

not connected

IN1+

8

channel 1 input positive

IN1

−

9

channel 1 input negative

SGND

10

signal ground

CLIP

11

clip detection output

V

P1

12

supply voltage 1

OUT1+

13

channel 1 output positive

PGND1

14

power ground 1

OUT1

−

15

channel 1 output negative

OUT2+

16

channel 2 output positive

PGND2

17

power ground 2

OUT2

−

18

channel 2 output negative

V

P2

19

supply voltage 2

MODE

20

mode select switch input
(standby/mute/operating)

handbook, halfpage

DIAG

IN2

+

IN2

−

n.c.

n.c.

n.c.

n.c.

IN1

+

IN1

−

SGND

MODE

VP2

OUT2

−

PGND2

OUT1

−

PGND1

OUT2

+

OUT1

+

VP1

CLIP

1

2

3

4

5

6

7

8

9

10

11

12

20

19

18

17

16

15

14

13

TDA8566TH

MGU356

Fig.2  Pin configuration.

Summary of Contents for TDA8566TH

Page 1: ...A SHEET Objective specification File under Integrated Circuits IC01 2001 Apr 24 INTEGRATED CIRCUITS TDA8566TH 2 40 W 2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs ...

Page 2: ...is an integrated class B output amplifier contained in a 20 lead small outline plastic package The device contains 2 amplifiers in a Bridge Tied Load BTL configuration The output power is 2 25 W in a 4 Ω load or 2 40 W in a 2 Ω load It has a differential input stage and 2 diagnostic outputs The device is primarily developed for car radio applications QUICK REFERENCE DATA ORDERING INFORMATION SYMBO...

Page 3: ...2 3 kΩ 2 3 kΩ mute switch CM VA VA 1 standby reference voltage standby switch mute reference voltage Vref mute switch CLIP 9 2 3 kΩ 2 3 kΩ 60 kΩ 60 kΩ 60 kΩ 60 kΩ mute switch CM VA 9 2 3 kΩ 2 3 kΩ mute switch CM VA 17 14 18 16 1 11 TDA8566TH 20 15 13 19 12 8 9 10 2 3 VP2 VP1 PGND2 PGND1 OUT2 OUT2 OUT1 OUT1 IN1 IN1 IN2 IN2 SGND n c DIAG MODE CLIP MGU358 9 2 3 kΩ 2 3 kΩ mute switch 4 5 6 7 DIAG Fig ...

Page 4: ...ed IN1 8 channel 1 input positive IN1 9 channel 1 input negative SGND 10 signal ground CLIP 11 clip detection output VP1 12 supply voltage 1 OUT1 13 channel 1 output positive PGND1 14 power ground 1 OUT1 15 channel 1 output negative OUT2 16 channel 2 output positive PGND2 17 power ground 2 OUT2 18 channel 2 output negative VP2 19 supply voltage 2 MODE 20 mode select switch input standby mute opera...

Page 5: ...t a HIGH level The clip detection waveforms are illustrated in Fig 3 Short circuit diagnostic pin DIAG When a short circuit occurs at one or more outputs to ground or to the supply voltage the output stages are switched off until the short circuit is removed and the device is switched on again with a delay of approximately 20 ms after the removal of the short circuit During this short circuit cond...

Page 6: ...dio amplifier THERMAL CHARACTERISTICS Thermal characteristics in accordance with IEC 60747 1 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VP supply voltage operating 18 V non operating 30 V load dump protection during 50 ms tr 2 5 ms 45 V IOSM non repetitive peak output current 10 A IORM repetitive peak output current 7 5 A Tstg storage temperature 55 150 C Tvj virtual junction temperature 150 C Tamb ...

Page 7: ...o 30 V the DC output voltage is 0 5VP SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply VP supply voltage note 1 6 14 4 18 V Iq quiescent current RL 115 180 mA Operating condition VMODE mode select switch level 8 5 VP V IMODE mode select switch current VMODE 14 4 V 15 40 µA VO output voltage note 2 7 0 V VOO output offset voltage 100 mV Mute condition VMODE mode select switch level 3 3 6 4 V VO ...

Page 8: ...RL 4 Ω 14 W VP 13 5 V THD 10 RL 4 Ω 22 W THD total harmonic distortion Po 1 W 0 1 VCLIP 0 6 V note 1 8 Po 1 W RL 4 Ω 0 05 B power bandwidth THD 0 5 Po 1 dB with respect to 25 W 20 to 20000 Hz fro l low frequency roll off 1 dB note 2 25 Hz fro h high frequency roll off 1 dB 20 kHz Gv closed loop voltage gain 25 26 27 dB SVRR supply voltage ripple rejection operating note 3 50 dB mute note 3 50 dB s...

Page 9: ...dth of 20 Hz to 20 kHz 5 Common mode rejection ratio measured at the output over RL with both inputs tied together Vcommon 3 5 V RMS fi 100 Hz to 10 kHz Rs 0 Ω 6 Common mode rejection ratio measured at the output over RL with both inputs tied together Vcommon 3 5 V RMS fi 1 kHz Rs 45 kΩ The mismatch of the input coupling capacitors is excluded Vo mute output signal voltage in mute Vin Vin max 1 V ...

Page 10: ...19 12 9 10 2 3 Fig 6 Stereo BTL test diagram Application information DIAGNOSTIC OUTPUT Special care must be taken in the PCB layout to separate pin CLIP from pins IN1 IN1 IN2 and IN2 to minimize the crosstalk between the CLIP output and the inputs MODE SELECT SWITCH To avoid switch on plops it is advisable to keep the amplifier in the mute mode during 150 ms charging of the input capacitors at pin...

Page 11: ...nal dimensions Notes 1 Limits per individual lead 2 Plastic or metal protrusions of 0 25 mm maximum per side are not included SOT418 2 0 5 10 mm scale HSOP20 plastic heatsink small outline package 20 leads low stand off height SOT418 2 A max detail X A2 3 5 3 2 D2 1 1 0 9 HE 14 5 13 9 Lp 1 1 0 8 Q 1 7 1 5 2 5 2 0 v 0 25 w 0 25 y Z 8 0 θ 0 07 x 0 03 D1 13 0 12 6 E1 6 2 5 8 E2 2 9 2 5 bp c 0 32 0 23...

Page 12: ...ity as solder bridging and non wetting can present major problems To overcome these problems the double wave soldering method was specifically developed If wave soldering is used the following conditions must be observed for optimal results Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave For packages with leads on two sides...

Page 13: ...board and heatsink at bottom version can not be achieved and as solder may stick to the heatsink on top version 3 If wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners 4 Wave soldering is only suitable for LQFP TQFP and QFP packages with a pitch e equal to o...

Page 14: ...a sheet or data handbook Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System IEC 60134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is n...

Page 15: ...2001 Apr 24 15 Philips Semiconductors Objective specification 2 40 W 2 Ω stereo BTL car radio power amplifier with differential inputs and diagnostic outputs TDA8566TH NOTES ...

Page 16: ...ILIPS SEMICONDUCTORS Via Casati 23 20052 MONZA MI Tel 39 039 203 6838 Fax 39 039 203 6800 Japan Philips Bldg 13 37 Kohnan 2 chome Minato ku TOKYO 108 8507 Tel 81 3 3740 5130 Fax 81 3 3740 5057 Korea Philips House 260 199 Itaewon dong Yongsan ku SEOUL Tel 82 2 709 1412 Fax 82 2 709 1415 Malaysia No 76 Jalan Universiti 46200 PETALING JAYA SELANGOR Tel 60 3 750 5214 Fax 60 3 757 4880 Mexico 5900 Gate...

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