1996 Dec 12
13
Philips Semiconductors
Product specification
Smart card interface
TDA8001
Fig.10 Power derating curve (DIP28).
handbook, halfpage
4
3
1
0
2
MBE256
50
0
50
100
150
Ptot
(W)
T ( C)
amb
o
Fig.11 Power derating curve (SO28).
handbook, halfpage
50
3
2
1
0
0
MBE255
50
100
150
Ptot
(W)
T ( C)
amb
o
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500
Ω
, 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
SOT117-1
30
K/W
SOT136-1
70
K/W
